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Электронный компонент: W29C040P-90B

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W29C040
512K
8 CMOS FLASH MEMORY
Publication Release Date: May 1999
- 1 -
Revision A5
GENERAL DESCRIPTION
The W29C040 is a 4-megabit, 5-volt only CMOS page mode EEPROM organized as 512K
8 bits.
The device can be written (erased and programmed) in-system with a standard 5V power supply. A
12-volt V
PP
is not required. The unique cell architecture of the W29C040 results in fast write (erase/
program) operations with extremely low current consumption compared to other comparable 5-volt
flash memory products. The device can also be written (erased and programmed) by using standard
EPROM programmers.
FEATURES
Single 5-volt write (erase and program)
operations
Fast page-write operations
-
256 bytes per page
-
Page write (erase/program) cycle: 5 mS
(typ.)
-
Effective byte-write (erase/program) cycle
time: 19.5
S
-
Optional software-protected data write
Fast chip-erase operation: 50 mS
Two 16 KB boot blocks with lockout
Typical page write (erase/program) cycles:
1K/10K (typ.)
Read access time: 90/120 nS
Ten-year data retention
Software and hardware data protection
Low power consumption
-
Active current: 25 mA (typ.)
-
Standby current: 20
A (typ.)
Automatic write (erase/program) timing with
internal V
PP
generation
End of write (erase/program) detection
-
Toggle bit
-
Data polling
Latched address and data
All inputs and outputs directly TTL compatible
JEDEC standard byte-wide pinouts
Available packages: TSOP and PLCC
W29C040
- 2 -
PIN CONFIGURATIONS
5
6
7
9
10
11
12
13
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
29
28
27
26
25
24
23
22
21
30
31
32
1
2
3
4
8
20
19
18
17
16
15
14
D
Q
1
D
Q
2
G
N
D
D
Q
3
D
Q
4
D
Q
5
D
Q
6
A14
A13
A8
A9
A11
OE
A10
CE
DQ7
A
1
2
A
1
6
V
C
C
/
W
E
A
1
5
A
1
7
32-pin
PLCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
OE
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
32-pin
TSOP
A15
A12
A7
A6
A5
A4
V
WE
A14
A13
A8
CC
A11
A9
A18
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A16
A17
A
1
8
BLOCK DIAGRAM
DECODER
CORE
ARRAY
CONTROL
OUTPUT
BUFFER
CE
OE
WE
A0
A18
.
.
.
DQ0
DQ7
.
.
16K Byte Boot Block (Optional)
16K Byte Boot Block (Optional)
V
V
CC
SS
PIN DESCRIPTION
SYMBOL
PIN NAME
A0
-
A18
Address Inputs
DQ0
-
DQ7
Data Inputs/Outputs
CE
Chip Enable
OE
Output Enable
WE
Write Enable
V
CC
Power Supply
GND
Ground
W29C040
Publication Release Date: May 1999
- 3 -
Revision A5
FUNCTIONAL DESCRIPTION
Read Mode
The read operation of the W29C040 is controlled by CE and OE , both Chip of which have to be low
for the host to obtain data from the outputs. CE is used for device selection. When CE is high, the
chip is de-selected and only standby power will be consumed. OE is the output control and is used to
gate data from the output pins. The data bus is in high impedance state when either CE or OE is
high.
Refer to the read cycle timing waveforms for further details.
Page Write Mode
The W29C040 is written (erased/programmed) on a page basis. Every page contains 256 bytes of
data. If a byte of data within a page is to be changed, data for the entire page must be loaded into the
device. Any byte that is not loaded will be erased to "FF hex" during the write operation of the page.
The write operation is initiated by forcing CE and WE low and OE high. The write procedure
consists of two steps. Step 1 is the byte-load cycle, in which the host writes to the page buffer of the
device.
Step 2 is an internal write (erase/program) cycle, during which the data in the page buffers are
simultaneously written into the memory array for non-volatile storage.
During the byte-load cycle, the addresses are latched by the falling edge of either CE or WE ,
whichever occurs last. The data are latched by the rising edge of either CE or WE , whichever
occurs first. If the host loads a second byte into the page buffer within a byte-load cycle time (T
BLC
) of
200
S after the initial byte-load cycle, the W29C040 will stay in the page load cycle. Additional bytes
can then be loaded consecutively. The page load cycle will be terminated and the internal write
(erase/program) cycle will start if no additional byte is loaded into the page buffer. A8 to A18 specify
the page address. All bytes that are loaded into the page buffer must have the same page address.
A0 to A7 specify the byte address within the page. The bytes may be loaded in any order; sequential
loading is not required.
In the internal write cycle, all data in the page buffers, i.e., 256 bytes of data, are written
simultaneously into the memory array. The typical write (erase/program) time is 5 mS. The entire
memory array can be written in 10.4 seconds. Before the completion of the internal write cycle, the
host is free to perform other tasks such as fetching data from other locations in the system to prepare
to write the next page.
Software-protected Data Write
The device provides a JEDEC-approved optional software-protected data write. Once this scheme is
enabled, any write operation requires a three-byte command sequence (with specific data to a
specific address) to be performed before the data load operation. The three-byte load command
sequence begins the page load cycle, without which the write operation will not be activated. This
write scheme provides optimal protection against inadvertent write cycles, such as cycles triggered by
noise during system power-up and power-down.
The W29C040 is shipped with the software data protection enabled. To enable the software data
protection scheme, perform the three-byte command cycle at the beginning of a page load cycle. The
device will then enter the software data protection mode, and any subsequent write operation must be
preceded by the three-byte command sequence cycle. Once enabled, the software data protection
W29C040
- 4 -
will remain enabled unless the disable commands are issued. A power transition will not reset the
software
data protection feature. To reset the device to unprotected mode, a six byte command sequence is
required. For information about specific codes, see the Command Codes for Software Data
Protection in the Table of Operating Modes. For information about timing waveforms, see the timing
diagrams below.
Hardware Data Protection
The integrity of the data stored in the W29C040 is also hardware protected in the following ways:
(1) Noise/Glitch Protection: A WE pulse of less than 15 nS in duration will not initiate a write cycle.
(2) V
CC
Power Up/Down Detection: The write operation is inhibited when V
CC
is less than 2.5V.
(3) Write Inhibit Mode: Forcing
OE low, CE high, or WE high will inhibit the write operation. This
prevents inadvertent writes during power-up or power-down periods.
(4) V
CC
power-on delay: When V
CC
has reach its sense level, the device will automatically time-out
10 mS before any write (erase/program) operation.
Chip Erase Modes
The entire device can be erased by using a six-byte software command code. See the Software Chip
Erase Timing Diagram.
Boot Block Operation
There are two boot blocks (16K bytes each) in this device, which can be used to store boot code. One
of them is located in the first 16K bytes and the other is located in the last 16K bytes of the memory.
The first 16K or last 16K of the memory can be set as a boot block by using a seven-byte command
sequence.
See Command Codes for Boot Block Lockout Enable for the specific code. Once this feature is set
the data for the designated block cannot be erased or programmed (programming lockout); other
memory locations can be changed by the regular programming method. Once the boot block
programming lockout feature is activated, the chip erase function will be disabled. In order to detect
whether the boot block feature is set on the two 16K blocks, users can perform a six-byte command
sequence: enter the product identification mode (see Command Codes for Identification/Boot Block
Lockout Detection for specific code), and then read from address "00002 hex" (for the first 16K bytes)
or "7FFF2 hex" (for the last 16K bytes). If the output data is "FF hex," the boot block programming
lockout feature is activated; if the output data is "FE hex," the lockout feature is inactivated and the
block can be programmed.
To return to normal operation, perform a three-byte command sequence to exit the identification
mode. For the specific code, see Command Codes for Identification/Boot Block Lockout Detection.
Data Polling (DQ7)- Write Status Detection
The W29C040 includes a data polling feature to indicate the end of a write cycle. When the
W29C040 is in the internal write cycle, any attempt to read DQ7 of the last byte loaded during the
page/byte-load cycle will receive the complement of the true data. Once the write cycle is completed.
DQ7 will show the true data. See the DATA Polling Timing Diagram.
W29C040
Publication Release Date: May 1999
- 5 -
Revision A5
Toggle Bit (DQ6)- Write Status Detection
In addition to data polling, the W29C040 provides another method for determining the end of a write
cycle. During the internal write cycle, any consecutive attempts to read DQ6 will produce alternating
0's and 1's. When the write cycle is completed, this toggling between 0's and 1's will stop. The device
is then ready for the next operation. See Toggle Bit Timing Diagram.
Product Identification
The product ID operation outputs the manufacturer code and device code. Programming equipment
automatically matches the device with its proper erase and programming algorithms.
The manufacturer and device codes can be accessed by software or hardware operation. In the
software access mode, a six-byte command sequence can be used to access the product ID. A read
from address "00000 hex" outputs the manufacturer code "DA hex." A read from address "00001 hex"
outputs the device code "46 hex." The product ID operation can be terminated by a three-byte
command sequence.
In the hardware access mode, access to the product ID is activated by forcing CE and OE low, WE
high, and raising A9 to 12 volts.
TABLE OF OPERATING MODES
Operating Mode Selection
Operating Range: 0 to 70
C (Ambient Temperature), V
DD
= 5V
10%, V
SS
= 0V, V
HH
= 12V
MODE
PINS
CE
OE
WE
ADDRESS
DQ.
Read
V
IL
V
IL
V
IH
A
IN
Dout
Write
V
IL
V
IH
V
IL
A
IN
Din
Standby
V
IH
X
X
X
High Z
Write Inhibit
X
V
IL
X
X
High Z/D
OUT
X
X
V
IH
X
High Z/D
OUT
Output Disable
X
V
IH
X
X
High Z
Product ID
V
IL
V
IL
V
IH
A0 = V
IL
; A1
-
A18 = V
IL
;
A9 = V
HH
Manufacturer Code DA
(Hex)
V
IL
V
IL
V
IH
A0 = V
IH
; A1
-
A18 = V
IL
;
A9 = V
HH
Device Code
46 (Hex)
W29C040
- 6 -
Command Codes for Software Data Protection
BYTE SEQUENCE
TO ENABLE PROTECTION
TO DISABLE PROTECTION
ADDRESS
DATA
ADDRESS
DATA
0 Write
5555H
AAH
5555H
AAH
1 Write
2AAAH
55H
2AAAH
55H
2 Write
5555H
A0H
5555H
80H
3 Write
-
-
5555H
AAH
4 Write
-
-
2AAAH
55H
5 Write
-
-
5555H
20H
Software Data Protection Acquisition Flow
Software Data Protection
Enable Flow
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data A0
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 80
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 20
to
address 5555
Software Data Protection
Disable Flow
Sequentially load
up to 256 bytes
of page data
Pause 10 mS
Exit
Pause 10 mS
Exit
(Optional page-load
operation)
Notes for software program code:
Data Format: DQ7
-
DQ0 (Hex)
Address Format: A14
-
A0 (Hex)
W29C040
Publication Release Date: May 1999
- 7 -
Revision A5
Command Codes for Software Chip Erase
BYTE SEQUENCE
ADDRESS
DATA
0 Write
5555H
AAH
1 Write
2AAAH
55H
2 Write
5555H
80H
3 Write
5555H
AAH
4 Write
2AAAH
55H
5 Write
5555H
10H
Software Chip Erase Acquisition Flow
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 80
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 10
to
address 5555
Pause 50 mS
Exit
Notes for software chip erase:
Data Format: DQ7
-
DQ0 (Hex)
Address Format: A14
-
A0 (Hex)
W29C040
- 8 -
Command Codes for Product Identification and Boot Block Lockout Detection
BYTE
SEQUENCE
ALTERNATE PRODUCT (7)
IDENTIFICATION/BOOT BLOCK
LOCKOUT DETECTION ENTRY
SOFTWARE PRODUCT
IDENTIFICATION/BOOT BLOCK
LOCKOUT DETECTION ENTRY
SOFTWARE PRODUCT
IDENTIFICATION/BOOT BLOCK
LOCKOUT DETECTION EXIT
ADDRESS
DATA
ADDRESS
DATA
ADDRESS
DATA
0 Write
5555
AA
5555H
AAH
5555H
AAH
1 Write
2AAA
55
2AAAH
55H
2AAAH
55H
2 Write
5555
90
5555H
80H
5555H
F0H
3 Write
-
-
5555H
AAH
-
-
4 Write
-
-
2AAAH
55H
-
-
5 Write
-
-
5555H
60H
-
-
Pause 10
S
Pause 10
S
Pause 10
S
Software Product Identification and Boot Block Lockout Detection Acquisition Flow
Product
Identification
Entry (1)
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 80
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 60
to
address 5555
Pause 10 uS
Product
Identification
and Boot Block
Lockout Detection
Mode (3)
Read address = 00000
data = DA
Read address = 00001
data = 46
Read address = 00002
data = FF/FE
(4)
Read address = 7FFF2
data = FF/FE
(5)
Product
Identification
Exit (1)
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data F0
to
address 5555
Pause 10 uS
Normal Mode
(6)
(2)
(2)
Notes for software product identification/boot block lockout detection:
(1) Data Format: DQ7
-
DQ0 (Hex); Address Format: A14
-
A0 (Hex)
(2) A1
-
A18 = V
IL
; manufacture code is read for A0 = V
IL
; device code is read for A0 = V
IH
.
(3) The device does not remain in identification and boot block (address 0002 Hex/7FFF2 Hex respond to first 16K/last 16K) lockout detection
mode if power down.
(4), (5) If the output data is "FF Hex," the boot block programming lockout feature is activated; if the output data "FE Hex," the lockout feature is
inactivated and the block can be programmed.
(6) The device returns to standard operation mode.
(7) This product supports both the JEDEC standard 3 byte command code sequence and original 6 byte command code sequence. For new
designs, Winbond recommends that the 3 byte command code sequence be used.
W29C040
Publication Release Date: May 1999
- 9 -
Revision A5
Command Codes for Boot Block Lockout Enable
BYTE SEQUENCE
BOOT BLOCK LOCKOUT FEATURE SET
ON FIRST 16K ADDRESS BOOT BLOCK
BOOT BLOCK LOCKOUT FEATURE SET
ON LAST 16K ADDRESS BOOT BLOCK
ADDRESS
DATA
ADDRESS
DATA
0 Write
5555H
AAH
5555H
AAH
1 Write
2AAAH
55H
2AAAH
55H
2 Write
5555H
80H
5555H
80H
3 Write
5555H
AAH
5555H
AAH
4 Write
2AAAH
55H
2AAAH
55H
5 Write
5555H
40H
5555H
40H
6 Write
00000H
00H
3FFFFH
FFH
Pause 10 mS
Pause 10 mS
Boot Block Lockout Enable Acquisition Flow
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 80
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 40
to
address 5555
Pause 10 mS
Load data 00
to
address 00000
Boot Block Lockout
Feature Set on First 16K
Address Boot Block
Boot Block Lockout
Feature Set on Last 16K
Address Boot Block
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 80
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 40
to
address 5555
Pause 10 mS
Load data FF
to
address 3FFFF
Notes for boot block lockout enable:
1. Data Format: DQ7
-
DQ0 (Hex)
2. Address Format: A14
-
A0 (Hex)
3. If you have any questions about this command sequence, please contact the local distributor or Winbond Electronics Corp.
W29C040
- 10 -
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER
RATING
UNIT
Power Supply Voltage to Vss Potential
-0.5 to +7.0
V
Operating Temperature
0 to +70
C
Storage Temperature
-65 to +150
C
D.C. Voltage on Any Pin to Ground Potential Except A9
-0.5 to V
DD
+1.0
V
Transient Voltage (<20 nS ) on Any Pin to Ground Potential
-1.0 to V
DD
+1.0
V
Voltage on A9 and OE Pin to Ground Potential
-0.5 to 12.5
V
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.
Operating Characteristics
(V
DD
= 5.0V
10
%
, V
SS
= 0V, T
A
= 0 to 70
C)
PARAMETER
SYM.
TEST CONDITIONS
LIMITS
UNIT
MIN.
TYP.
MAX.
Power Supply Current
I
CC
CE = OE = V
IL
, WE = V
IH
,
all DQs open
Address inputs = V
IL
/V
IH
,
at f = 5 MHz
-
-
50
mA
Standby V
DD
Current
(TTL input)
I
SB
1
CE = V
IH
, all DQs open
Other inputs = V
IL
/V
IH
-
2
3
mA
Standby V
DD
Current
(CMOS input)
I
SB
2
CE = V
DD
-0.3V, all DQs
open
-
20
100
A
Input Leakage Current
I
LI
V
IN
= GND to V
DD
-
-
10
A
Output Leakage Current
I
LO
V
IN
= GND to V
DD
-
-
10
A
Input Low Voltage
V
IL
-
-
-
0.8
V
Input High Voltage
V
IH
-
2.0
-
-
V
Output Low Voltage
V
OL
I
OL
= 2.0 mA
-
-
0.45
V
Output High Voltage
V
OH1
I
OH
= -400
A
2.4
-
-
V
Output High Voltage
CMOS
V
OH2
I
OH
= -100
A; V
CC
= 4.5V
4.2
-
-
V
W29C040
Publication Release Date: May 1999
- 11 -
Revision A5
Power-up Timing
PARAMETER
SYMBOL
TYPICAL
UNIT
Power-up to Read Operation
T
PU
. READ
100
S
Power-up to Write Operation
T
PU
. WRITE
10
mS
CAPACITANCE
(V
DD
= 5.0V, T
A
= 25
C, f = 1 MHz)
PARAMETER
SYMBOL
CONDITIONS
MAX.
UNIT
DQ Pin Capacitance
C
DQ
V
DQ
= 0V
12
pF
Input Pin Capacitance
C
IN
V
IN
= 0V
6
pF
AC CHARACTERISTICS
AC Test Conditions
(V
DD
= 5.0V
10
%
for 90,120 nS
PARAMETER
CONDITIONS
Input Pulse Levels
0V to 3V
Input Rise/Fall Time
<5 nS
Input/Output Timing Level
1.5V/1.5V
Output Load
1 TTL Gate and C
L
= 100 pF for 90/120/150 nS
AC Test Load and Waveform
+5V
1.8K
1.3K
D
OUT
100 pF for 90/120 nS
(Including Jig and Scope)
Input
3V
0V
Test Point
Test Point
1.5V
1.5V
Output
W29C040
- 12 -
AC Characteristics, continued
Read Cycle Timing Parameters
(V
DD
= 5.0V
10
%
for 90,120 and 150 nS, V
SS
= 0V, T
A
= 0 to 70
C)
PARAMETER
SYM.
W29C040-90
W29C040-12
UNIT
MIN.
MAX.
MIN.
MAX.
Read Cycle Time
T
RC
90
-
120
-
nS
Chip Enable Access Time
T
CE
-
90
-
120
nS
Address Access Time
T
AA
-
90
-
120
nS
Output Enable Access Time
T
OE
-
40
-
50
nS
CE High to High-Z Output
T
CHZ
-
25
-
30
nS
OE High to High-Z Output
T
OHZ
-
25
-
30
nS
Output Hold from Address change
T
OH
0
-
0
-
nS
Byte/Page-write Cycle Timing Parameters
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Write Cycle (erase and program)
T
WC
-
-
10
mS
Address Setup Time
T
AS
0
-
-
nS
Address Hold Time
T
AH
50
-
-
nS
WE and CE Setup Time
T
CS
0
-
-
nS
WE and CE Hold Time
T
CH
0
-
-
nS
OE High Setup Time
T
OES
0
-
-
nS
OE High Hold Time
T
OEH
0
-
-
nS
CE Pulse Width
T
CP
70
-
-
nS
WE Pulse Width
T
WP
70
-
-
nS
WE High Width
T
WPH
100
-
-
nS
Data Setup Time
T
DS
50
-
-
nS
Data Hold Time
T
DH
0
-
-
nS
Byte Load Cycle Time
T
BLC
-
-
150
S
Notes:
All AC timing signals observe the following guideline for determining setup and hold times:
(1) High level signal's reference level is V
IH
(2) Low level signal's reference level is V
IL
W29C040
Publication Release Date: May 1999
- 13 -
Revision A5
AC Characteristics, continued
DATA Polling Characteristics
(1)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Data Hold Time
T
DH
10
-
-
nS
OE Hold Time
T
OEH
10
-
-
nS
OE to Output Delay
(2)
T
OE
-
-
-
nS
Write Recovery Time
T
WR
0
-
-
nS
Notes:
(1) These parameters are characterized and not 100% tested.
(2) See T
OE
spec in A.C. Read Cycle Timing Parameters
.
Toggle Bit Characteristics
(1)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Data Hold Time
T
DH
10
-
-
nS
OE Hold Time
T
OEH
10
-
-
nS
OE to Output Delay
(2)
T
OE
-
-
-
nS
OE High Pulse
T
OEHP
150
-
-
nS
Write Recovery Time
T
WR
0
-
-
nS
Notes:
(1) These parameters are characterized and not 100% tested.
(2) See T
OE
spec in A.C. Read Cycle Timing Parameters
.
TIMING WAVEFORMS
Read Cycle Timing Diagram
Address A18-0
DQ7-0
Data Valid
Data Valid
High-Z
CE
OE
WE
T
RC
V
IH
T
OE
T
CE
T
OH
T
AA
T
CHZ
T
OHZ
High-Z
W29C040
- 14 -
Timing Waveforms, continued
WE Controlled Write Cycle Timing Diagram
Address A18-0
DQ7-0
Data Valid
Internal write starts
CE
OE
WE
T
AS
T
CS
T
OES
T
AH
T
WC
T
CH
T
OEH
T
WPH
T
WP
T
DS
T
DH
CE Controlled Write Cycle Timing Diagram
High Z
Data Valid
Internal Write Starts
Address A18-0
CE
OE
WE
T
AS
T
AH
T
WC
T
OEH
T
DH
T
DS
T
CP
T
OES
DQ7-0
T
WPH
T
CS
T
CH
W29C040
Publication Release Date: May 1999
- 15 -
Revision A5
Timing Waveforms, continued
Page Write Cycle Timing Diagram
Address A18-0
Byte 0
Byte 1
Byte 2
Byte N-1
Byte N
Internal Write Start
DQ7-0
CE
OE
WE
T
WC
T
BLC
T
WPH
T
WP
DATA Polling Timing Diagram
Address A18-0
DQ7
WE
OE
CE
T
DH
T
OEH
T
OE
HIGH-Z
T
WR
W29C040
- 16 -
Timing Waveforms, continued
Toggle Bit Timing Diagram
DQ6
WE
OE
CE
T
DH
T
OE
HIGH-Z
T
WR
T
OEH
Page Write Timing Diagram Software Data Protection Mode
5555
5555
AA
55
A0
Three-byte sequence for
software data protection mode
Byte/page load
cycle starts
Internal write starts
Byte N
(Last Byte)
Byte 0
SW2
SW1
SW0
Address A18-0
DQ7-0
CE
OE
WE
2AAA
T
WP
T
WPH
T
BLC
Byte N-1
T
WC
W29C040
Publication Release Date: May 1999
- 17 -
Revision A5
Timing Waveforms, continued
Reset Software Data Protection Timing Diagram
SW2
SW1
SW0
Address A18-0
DQ7-0
CE
OE
WE
SW3
SW4
SW5
Internal programming starts
Six-byte sequence for resetting
software data protection mode
T
WC
T
WP
T
WPH
T
BLC
5555
2AAA
5555
5555
2AAA
5555
AA
55
80
AA
55
20
5 Volt-only Software Chip Erase Timing Diagram
SW2
SW1
SW0
Address A18-0
DQ7-0
CE
OE
WE
SW3
SW4
SW5
Internal erasing starts
Six-byte code for 5V-only software
chip erase
T
WC
T
WP
T
WPH
T
BLC
5555
2AAA
5555
5555
2AAA
5555
AA
55
80
AA
55
10
W29C040
- 18 -
ORDERING INFORMATION
PART NO.
ACCESS
TIME
(nS)
POWER
SUPPLY CURRENT
MAX. (mA)
STANDBY
V
DD
CURRENT
MAX. (
A)
PACKAGE
CYCLING
W29C040T-90
90
50
100
Type one TSOP
1K
W29C040T-12
120
50
100
Type one TSOP
1K
W29C040P-90
90
50
100
32-pin PLCC
1K
W29C040P-12
120
50
100
32-pin PLCC
1K
W29C040T-90B
90
50
100
Type one TSOP
10K
W29C040T-12B
120
50
100
Type one TSOP
10K
W29C040P-90B
90
50
100
32-pin PLCC
10K
W29C040P-12B
120
50
100
32-pin PLCC
10K
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in
applications where personal injury might occur as a consequence of product failure.
W29C040
Publication Release Date: May 1999
- 19 -
Revision A5
PACKAGE DIMENSIONS
32-pin PLCC
L
c
1
b
2
A
H
E
E
e
b
D H
D
y
A
A
1
Seating Plane
E
G
G
D
1
13
14
20
29
32
4
5
21
30
1. Dimensions D & E do not include interlead flash.
2. Dimension b1 does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on final
visual inspection sepc.
Symbol
Min.
Nom.
Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
3.56
0.50
2.80
2.67
2.93
0.71
0.66
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89
13.97
14.05
11.35
11.43
11.51
1.27
12.45
12.95
13.46
9.91
10.41
10.92
14.86
14.99
15.11
12.32
12.45
12.57
1.91
2.29
0.004
0.095
0.090
0.075
0.495
0.490
0.485
0.595
0.590
0.585
0.430
0.410
0.390
0.530
0.510
0.490
0.050
0.453
0.450
0.447
0.553
0.550
0.547
0.014
0.010
0.008
0.022
0.018
0.016
0.032
0.026
0.028
0.115
0.105
0.110
0.020
0.140
1.12
1.42
0.044
0.056
0
10
10
0
0.10
2.41
Notes:
A
b
c
D
e
H
E
L
y
A
A
1
2
E
b
1
G
D
H
D
G
E
40-pin TSOP
A
A
A
2
1
L
L
1
Y
c
E
H
D
D
b
e
M
0.10 (0.004)
1
Dimension in mm
Dimension in Inches
Min.
Nom. Max.
Symbol
A
D
E
e
L
L
Y
1
1
A
H
D
Controlling dimension: Millimeters
0.05
18.3
9.90
19.8
0.50
0.00
0
18.4
10
20.0
0.50
0.60
0.8
3
1.20
0.15
18.5
10.10
20.2
0.70
0.10
5
0.047
0.006
A
2
1.00
0.95
1.05
0.041
0.039
0.037
b
0.17
0.22
0.27
0.007 0.009
0.011
c
0.10
0.15
0.20
0.004 0.006 0.008
0.72
0.724 0.728
0.390 0.394 0.398
0.780 0.787 0.795
0.020
0.020 0.024
0.028
0.031
0.000
0.004
0
3
5
0.002
Min.
Nom. Max.
W29C040
- 20 -
VERSION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A1
Apr. 1997
-
Initial Issued
A2
Nov. 1997
4, 8
Correct the address from 3FFF2 to 7FFF2
9
Correct the boot block from 8K to 16K
15
Modify page write cycle timing diagram waveform
1, 18
Delete cycling 100K item
6
Add. pause 10 mS
7
Add. pause 50 mS
8
Correct the time from 10 mS to 10
S
A3
June 1998
4
Correct power-on delay from 5 mS to 10 mS
11
Correct T
PU.
WRITE (Typ.) from 5 mS to 10 mS
A4
Oct. 1998
20
Correct 40-pin TSOP package drawing by 32-pin TSOP
9
Correct the address from 3FFFF to 7FFFF
A5
May 1999
1, 12, 18
Modify TACC:
90/120/150 nS
90/120 nS binning
1, 2, 18, 19
Modify package:
PDIP/SOP/PLCC/TSOP
PLCC/TSOP
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5796096
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Note: All data and specifications are subject to change without notice.