ChipFind - документация

Электронный компонент: W536XXXP

Скачать:  PDF   ZIP

Document Outline







Publication Release Date: Sep 2000
- 1 - Revision A3
GENERAL DESCRIPTION
The W536XXXP, a member of ViewTalk
TM
family, is a high-performance 4-bit micro-controller (uC)
with built-in 8KW uC program. The 4-bit uC core contains dual clock source, 4-bit ALU, two 8-bit
timers, one 14 bits divider, maximum 32 pads for input or output, 8 interrupt sources and 8-level
nesting for subroutine/interrupt applications. Speech unit, integrated as a single chip with maximum
128 seconds (based on 6.4K sample rate with 5 bits MDPCM) , is capable of expanding to 512
seconds speech addressed by external memory W55XXX with serial bus interface. It can be
implemented with Winbond Power Speech using MDPCM algorithm. Melody unit provides dual tone
output and can store up to 1k notes. Power reduction mode is also built in to minimize power
dissipation. It is ideal for educational toys, remote controllers and other application products which
incorporate both melody and speech.
Body
W536030P W536060P W536090P
W536120P
Voice
30 sec
60 sec
90 sec
120 sec
I/O pad
8I/O, 8I
(RA/RB/RC/RD)
8I/O, 8I
(RA/RB/RC/RD)
8I/O, 12I, 12O
(RA/RB/RC/RD/RE/RF
/RG/RH)
8I/O, 12I, 12O
(RA/RB/RC/RD/RE/RF
/RG/RH)
WDT disable/Enable
(Mask Option)
Y Y
Y
Y
Sub-clock
RC/XTAL mode
(Mask Option)
Y Y
Y
Y
Tri-state serial bus
(Mask Option)( 1)
Y Y
Y
Y
Cascaded Voice
through serial bus (2)
Y Y
N
Y
(1) Tri-state serial bus mask option can float serial bus while voice playing is no active. Let
this mask option is disabled to get minimum power consumption in general.
(2) Cascaded Voice ROM user option help to expand voice up to 512 sec through serial bus
by W55XXX chip
.
FEATURES



Operating voltage: 2.4 volt ~ 5.5 volt
Watch dog disabled/enabled by mask option
Dual clock operating system
-
Main clock with RC/Crystal (400 KHz to 4 MHz)
-
Sub-clock with 32.768 KHz RC/Crystal by mask option
Memory
-
Program ROM (P-ROM): 8 K
20 (ROM Bank0)
-
Data RAM (W-RAM): 1K
4 bit
(RAM Bank 0 is 512 nibbles from 0:000~0:1FF and 0:380~0:3FF are mapped to special register.
RAM Bank F is 512 nibbles from F:200~F:3FF either data RAM or dedicated to script kernel )
Maximum 32 input/output pads
-
Ports for input only: 12 pads (RC, RD and RG port ; RG for W536090P/120P only)
-
Ports for output only: 12 pads (RE, RF and RH port; RH for W536090P/120P only)
-
Ports for Input/output: 8 pads
Publication Release Date:Sep 2000
- 2 - Revision A3
Power-down mode
-
Hold mode (except for 32kHz oscillator)
-
Stop mode (including 32kHz oscillator and release by RD or RC port)
Eight types of interrupts
-
Five internal interrupts (Divider, Timer 0, Timer 1, Speech, Melody )
-
Three external interrupts (Port RC, RD, RA)
One built-in 14-bit clock frequency divider circuit
Two built-in 8-bit programmable countdown timers
-
Timer 0: one of two clock sources (FOSC/4 or FOSC/1024) can be selected
-
Timer 1: built-in auto-reload function includes internal timer, external event counter from
RC.0
Built-in 18/14-bit watchdog timer for system reset.
Powerful instruction sets.
8-level subroutine (including interrupt) nesting
Speech function
-
Provided 1M / 2M/ 3M/ 4M bits Voice ROM for W536030P/060P/090P/120P based on 5 bits
MDPCM algorithm
-
Voice ROM (V-ROM) available for uC data.
-
Maximum 8*256 Label/Interrupt vector (voice section number) available
-
Provide two types of speech busy flag to either each GO or each trigger
-
Maximum up to 16M bits speech address capability interface with external memory W55XXX
through serial bus.
Melody function
-
Provide 1K notes (22bits/note) dedicated melody ROM
-
Provide two types of melody busy flag to uC either each note or each song
-
Provide 6 kinds of beat, 16 kinds of tempo, and pitch range from G3# to C7
-
Tremolo, triple frequency and 3 kinds of percussion available
-
Maximum 31 songs available
Can mix speech with melody
Multi-engine controller
Direct driving speaker/buzzer or DAC output
Chip On Board available
Publication Release Date:Sep 2000
- 3 - Revision A3



BLOCK DIAGRAM

PC
STACK
(8 Levels)
Timer 0
(8 Bit)
Timing Generator
XIN
XOUT
Timer 1
(8 Bit)
Watch Dog Timer
(18/14 Bit)
ALU
ACC
Divider
(14/10 Bit)
X32I X32O
ROM
8K*20Bit
RAM
1K* 4Bit
Interrupt ,Hold
& Stop Control
Special Register
HCF
HEF
IEF
EVF
FLAG1
PSR0
MR0
PEF
FLAG0
LPX3
PM0
LPX2
LPX0
LPX1
LPX4
LPX5 LPY0
LPY1
SPC MLD
PORT RE
PORT RA
TONE
RA0~3
RE0~3
PORT RB
PORT RD
PORT RE
RB0~3
RD0~3
PORT RC
RC0~3
PORT RG
RG0~3
PORT RF
RF0~3
PORT RH
RH0~3
WRP
MLD_play
MLD_busy
Speech
MDPCM
core
SPC_play
SPC_busy
PWM1/DAC
ROSC
Parallel
to
Serial
RDP
SPDATA
VSSP
TEST
Voice ROM
(1M /2M/3M/4M
bits)
PWM/
DAC
Mix
Block
PWM2
VDDP
LPXY
Shared_ROM Data
RES
VDDA
VSSA
VDD
VSS
Dual Tone
Melody
(1K notes)
Publication Release Date:Sep 2000
- 4 - Revision A3
PAD DESCRIPTION
SYMBOL I/O
FUNCTION
XIN/RXIN
I
Input pad for main clock oscillator. It can be connected to crystal when crystal
mode is selected (SCR0.2=1), otherwise connect a resistor to VDD to generate
main system clock while RC mode is selected (SCR0.2=0 and default). Oscillator
can be enabled or stopped by set SCR0.1 to 1 or clear to 0 separately. External
capacitor connects to start oscillation while crystal mode
XOUT
O
Output pad for oscillator which is connected to another crystal pad when in crystal
mode. External capacitor connects to start oscillation when in crystal mode.
X32I/RSUB1 I 32.768 KHz crystal input pad or external resistor node 1 by mask option.
External 15~20pF capacitor connects to get more accurate clock when in crystal
mode.
X32O/RSUB2 O 32.768 KHz crystal output pad or external resistor node 2 by mask option.
External 15~20pF capacitor connects to get more accurate clock when in crystal
mode.
RA0 ~ RA3/TONE I/O
General Input/Output port specified by PM1 register. If output mode is selected,
PM0 register bit 0 can be used to specify CMOS/NMOS driving capability option.
Initial state is input mode. RA3 may be uses as TONE if bit 0 of MR0 special
register is set to logic 1. An interrupt source.
RB0 ~ RB3
I/O
General Input/Output port specified by PM2 register. If output mode is selected,
PM0 register bit 1 can be used to specify CMOS/NMOS driving capability option.
Initial state is input mode.
RC0 ~ RC3
I
4-bit schmitter input with internal pull high option specified by PM3 register bit 2.
Each pad has an independent interrupt capability specified by PEFL special
register. Interrupt and STOP mode wake up source. RC0 is also the external
event counter source of Timer1.
RD0 ~ RD3
I
4-bit schmitter input port with internal pull high option specified by PM3 register
bit 3. Each pad has an independent interrupt capability specified by PEFH
special register. Interrupt and STOP mode wake up source.
RE0~RE3
O Output port only. PM3 register bit 0 can be used to specify CMOS/NMOS driving
capability option.
RF0~RF3
O
Output port only. PM3 register bit 1 can be used to specify CMOS/NMOS driving
capability option.
RG0 ~ RG3
I
Input port with internal pull high option specified by PM6 register bit 0.
(W536090P/W536120P only)
RH0 ~ RH3
O
Output port only. PM6 register bit 1 can be used to specify CMOS/NMOS driving
capability option. (W536090P/W536120P only)
RES
I
System reset pad, active low with internal pull-high resistor.
TEST
I
Test pad. Active high with internal pull low resistor.
ROSC
I
Connect resistor to VDD pad to generate speech or melody playing clock source.
PWM1/DAC
O
While speech or melody is active, PWM1/DAC is speaker direct driving output or
DAC output controlled by voice output file.
PWM2
O
While speech or melody is active, PWM2 is another speaker direct driving output.
WRP
O
External serial memory address write clock for voice extension.
Publication Release Date:Sep 2000
- 5 - Revision A3
RDP
O
External serial memory address read clock for voice extension.
SPDATA
I/O
External serial memory data in/out for voice extension.
VSS I
Chip
ground.
VSSP
I
Chip ground for PWM or DAC playing output.
VSSA (3)
I
Chip ground. (W536090P/120P only)
VDD
I
Power source.
VDDP
I
Power source for PWM or DAC playing output.
VDDA (3)
I
Power source. (W536090P/120P only)
(3)
VDDA, VSSA for W536090P/120P only. To sure chip operation properly, please bond all
VDD, VDDA, VDDP, VSS, VSSA and VSSP pads, and connect VSS, VSSP form chip external
PCB circuit.
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING
UNIT
Supply Voltage to Ground Potential
-0.3 to +7.0
V
Applied Input/Output Voltage
-0.3 to +7.0
V
Power Dissipation
120
mW
Ambient Operating Temperature
0 to +70
C
Storage Temperature
-55 to +150
C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely
affect the life and reliability of the device.
DC CHARACTERISTICS
(VDD
-
VSS = 3.0V, No load, F
M
= 4 MHz with RC mode, Fs = 32.768 KHz, with Xtal mode, T
A
= 25
C
unless otherwise specified)
PARAMETER
SYM. CONDITIONS
MIN
TYP
MAX
UNIT
Op. Voltage
V
DD
2.4
5.5
V
Op. Current
I
OP1
Dual clock with crystal
-
400
500
uA
(No Load, no Voice, no
Dual clock with RC type
400
500
Melody)
Sub-clock
only
15
30
Hold Mode Current
I
OP2
Sub-clock active only
4
6
uA
Stop Mode Current
I
OP3
1
uA
RDP/WRP Output High
Current
Io
H1
Vout =2.7V
-0.8
mA
RDP/WRP Output low
Current
Io
L1
Vout =0.4V
0.8 mA
Input Low Voltage
V
IL
- VSS
-
0.3
VDD
Input High Voltage
V
IH
-
0.7 -
1
VDD
Port RA, RB, RE,RF and RH
Output Low Voltage
V
ABL
IOL = 2.0 mA
-
-
0.4
V
Port RA, RB, RE,RF and RH
Output High Voltage
V
ABH
IOH = -2.0 mA
2.4
-
-
V
Publication Release Date:Sep 2000
- 6 - Revision A3
Pull-up Resistor
R
CD
Port RC, RD, RG
200
300
400
K
RES Pull-up Resistor
R
RES
- 50
100
200
K
PWM1/2 Source Current (4)
I
SPH
Volume Option =00
-20
mA
(R
LOAD
=8
between PWM1
Volume Option =01
-70
And PWM2 )
Volume Option =10
-110
Volume Option =11
-135
PWM1/2 Sink Current (4)
I
SPL
Volume Option =00
20
mA
(R
LOAD
=8
between PWM1
Volume Option =01
70
And PWM2 )
Volume Option =10
110
Volume Option =11
135
DAC output Current
I
DAC
VDD=3v, RL=100ohm
-4
-5
-6
mA
(4)
PWM current deviation will be
20%.

AC CHARATERISTICS
(VDD
-
VSS = 3.0V, No load, F
M
= 4 MHz with RC mode, Fs = 32.768 KHz, with Xtal mode, T
A
= 25
C
unless otherwise specified)
PARAMETER
SYM.
CONDITIONS
MIN.
TYP.
MAX. UNIT
Sub-clock Frequency
F
SUB
Crystal type and X32IN
and X32O with 17pF
external cap.
32768
Hz
Main-clock Frequency
F
M
RC type/Crystal type
400K -
4M
Hz
Chip Operation Frequency
F
OSC
SCR0.0=1,F
SYS
= F
SUB
32768
Hz
SCR0.0=0;F
SYS
= F
MAIN
400K
-
4M
Instruction Cycle Time
T
CYC
One machine cycle
-
4/F
OSC
- S
Reset Active Width
T
RAW
FOSC = 32.768 KHz
1
-
-
S
Interrupt Active Width
T
IAW
FOSC = 32.768 KHz
1
-
-
S
Main clock RC frequency
F
RXIN
RXIN =680K
1M Hz
RXIN =330K
2M
RXIN =200K
3M
RXIN =130K
4M
Sub-Clock Ring Oscillator
F
RSUB
R
SUB
=680K
32 KHz
Sub-Clock Oscillation
Stable Time @ Cold Start
F
STOP
R
SUB
=680K
0.8
1 S
Frequency Deviation of
main-clock F
RXIN
2
MHz
f
f
f(3V) f(2.4V)
f(3V)
-
10
%
Frequency Deviation of
main-clock F
RXIN
=
3
MHz
f
f
f(3V) f(2.4V)
f(3V)
-
15
%
Frequency Deviation of
main-clock F
RXIN
=
4
MHz
f
f
f(3V) f(2.4V)
f(3V)
-
20
%
ROSC Frequency
F
ROSC
R
OSC
=680K
3
MHz
Frequency Deviation of
F
ROSC
= 3MHz
f
f
f(3V) f(2.4V)
f(3V)
-
7.5
%
(5)
The deviation will be +20% while VDD drops from 5.5V to 2.4V based on same resistor
Publication Release Date:Sep 2000
- 7 - Revision A3








































Iop Vs. Main clock RC mode
0
200
400
600
800
1
2
3
4
Freq (MhZ)
Iop (uA)
3V
4.5V
Oscillation Freq Vs. Sub-Clock
20
24
28
32
36
40
44
560
620
680
750
820
1K
Rsub (Kohm)
Fsub (KhZ)
3V
4.5V
Publication Release Date:Sep 2000
- 8 - Revision A3

Main Freq Vs. Rxin
0
1
2
3
4
5
6
130 150 160 200 330 680 2K
3K
RXIN (Kohm)
Fmain
(MhZ)
2.4V
3v
4.5V
5.5V



Voice Operating Freq. Vs. ROSC
2
2.5
3
3.5
4
4.5
470
560
680
910
ROSC (Kohm)
Freq (MhZ)
3V
4.5V

Publication Release Date:Sep 2000
- 9 - Revision A3
APPLICATION CIRCUIT--1: Sub clock with RC mode
W536XXXP
RC0~3
RD0~3
RA0~3
RB0~3
RE0~3
X32IN
X32O
Battery
R4
C1
VDD
VDDP
R1
R3
ROSC
XIN
VSSP
VSS
RES
C3
VDDP
PWM2
PWM1/DAC
RF0~3
( *1)
R5
470
(*2)
VDD
C2
SPDATA
RDP
WRP
W55M08
RG0~3
RH0~3
R2
VDDA
VSSA
Component
C1
C2 C3 R1 R2 R3
R4
Value
0.1uF 4.7uF 0.1uF 680K 680K 680Kohm/1Mhz
330Kohm/2Mhz
200Kohm/3Mhz
130Kohm/4Mhz
100
Note:
(1) Option R5 equals to 100
if high noise immunity is needed.
(2) For DAC option application
(3)
To sure chip operation properly, please bond all VDDP, VDD, VDDA, VSSP, VSSA and VSS
(4)
VDDA, VSSA are only for W536090P/120P.
Publication Release Date:Sep 2000
- 10 - Revision A3
APPLICATION CIRCUIT--2: Sub clock with Xtal mode

Component
C1
C2 C3 C4~C5 R1 R3
R4
Value
0.1uF 4.7uF 0.1uF 17pF~20pF 680K 680Kohm/1Mhz
330Kohm/2Mhz
200Kohm/3Mhz
130Kohm/4Mhz
100
Note:
(1) Option R5 equals to 100
if high noise immunity is needed.
(2) For DAC option application.
(3)
To sure chip operation properly, please bond all VDDP, VDD, VDDA, VSSP , VSSA and VSS .
(4)
VDDA and VSSA are only for W536090P/120P.
W536XXXP
RC0~3
RD0~3
RA0~3
RB0~3
RE0~3
32.768kHz
C4
X32IN
X32O
Battery
R4
C1
VDD
VDDP
R1
R3
ROSC
XIN
VSSP
VSS
RES
C3
VDDP
PWM2
PWM1/DAC
RF0~3
( * 1)
R5
470
(*2)
VDD
C2
C5
SPDATA
RDP
WRP
W55M08
RG0~3
RH0~3
VSSA
VDDA