W78C32C
8-BIT MICROCONTROLLER
Publication Release Date: July 1999
- 1 - Revision A2
GENERAL DESCRIPTION
The W78C32C microcontroller supplies a wider frequency range than most 8-bit microcontrollers on
the market. It is compatible with the industry standard 80C32 microcontroller series.
The W78C32C contains four 8-bit bidirectional parallel ports, three 16-bit timer/counters, and a serial
port. These peripherals are supported by a six-source, two-level interrupt capability. There are 256
bytes of RAM, and the device supports ROMless operation for application programs.
The W78C32C microcontroller has two power reduction modes, idle mode and power-down mode,
both of which are software selectable. The idle mode turns off the processor clock but allows for
continued peripheral operation. The power-down mode stops the crystal oscillator for minimum power
consumption. The external clock can be stopped at any time and in any state without affecting the
1.processor.
FEATURES
8-bit CMOS microcontroller
Fully static design
Low standby current at full supply voltage
DC-40 MHz operation
256 bytes of on-chip scratchpad RAM
ROMless operation
64K bytes program memory address space
64K bytes data memory address space
Four 8-bit bidirectional ports
Three 16-bit timer/counters
One full duplex serial port
Boolean processor
Six-source, two-level interrupt capability
Built-in power management
Packages:
-
DIP 40:
W78C32C-24/40
-
PLCC 44: W78C32CP-24/40
-
QFP 44: W78C32CF-24/40
W78C32C
- 2 -
PIN CONFIGURATIONS
Vcc
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
39
40
34
35
36
37
38
30
31
32
33
26
27
28
29
21
22
23
24
25
P0.0, AD0
P0.1, AD1
P0.2, AD2
P0.3, AD3
P0.4, AD4
P0.5, AD5
P0.6, AD6
P0.7, AD7
EA
ALE
PSEN
P2.5, A13
P2.6, A14
P2.7, A15
P2.0, A8
P2.1, A9
P2.2, A10
P2.3, A11
P2.4, A12
T2, P1.0
40-Pin DIP (W78C32C)
P1.2
P1.3
P1.4
P1.5
P1.6
RXD, P3.0
TXD, P3.1
P1.7
RST
INT0, P3.2
INT1, P3.3
T0, P3.4
T1, P3.5
WR, P3.6
RD, P3.7
XTAL1
XTAL2
Vss
T2EX, P1.1
44-Pin PLCC (W78C32CP)
44-Pin QFP (W78C32CF)
34
40 39 38 37 36 35
44 43 42 41
33
32
31
30
29
28
27
26
25
24
23
P0.4, AD4
P0.5, AD5
P0.6, AD6
P0.7, AD7
EA
NC
ALE
PSEN
P2.7, A15
P2.6, A14
P2.5, A13
22
21
20
19
18
17
16
15
14
13
12
11
4
3
2
1
8
7
6
5
10
9
P1.5
P1.6
P1.7
RST
RXD, P3.0
NC
TXD, P3.1
INT0, P3.2
INT1, P3.3
T0, P3.4
T1, P3.5
X
T
A
L
1
V
S
S
P
2
.
4
,
A
1
2
P
2
.
3
,
A
1
1
P
2
.
2
,
A
1
0
P
2
.
1
,
A
9
P
2
.
0
,
A
8
X
T
A
L
2
P
3
.
7
,
/
R
D
P
3
.
6
,
/
W
R
N
C
A
D
3
,
P
0
.
3
T
2
,
P
1
.
0
P
1
.
2
N
C
V
C
C
A
D
2
,
P
0
.
2
A
D
1
,
P
0
.
1
A
D
0
,
P
0
.
0
T
2
E
X
,
P
1
.
1
P
1
.
3
P
1
.
4
40
2 1 44 43 42 41
6 5 4 3
39
38
37
36
35
34
33
32
31
30
29
P0.4, AD4
P0.5, AD5
P0.6, AD6
P0.7, AD7
EA
NC
ALE
PSEN
P2.7, A15
P2.6, A14
P2.5, A13
28
27
26
25
24
23
22
21
20
19
18
17
10
9
8
7
14
13
12
11
16
15
P1.5
P1.6
P1.7
RST
RXD, P3.0
NC
TXD, P3.1
INT0, P3.2
INT1, P3.3
T0, P3.4
T1, P3.5
A
D
3
,
P
0
.
3
T
2
,
P
1
.
0
P
1
.
2
N
C
V
C
C
A
D
2
,
P
0
.
2
A
D
1
,
P
0
.
1
A
D
0
,
P
0
.
0
T
2
E
X
,
P
1
.
1
P
1
.
3
P
1
.
4
X
T
A
L
1
V
S
S
P
2
.
4
,
A
1
2
N
C
P
2
.
3
,
A
1
1
P
2
.
2
,
A
1
0
P
2
.
1
,
A
9
P
2
.
0
,
A
8
X
T
A
L
2
P
3
.
7
,
/
R
D
P
3
.
6
,
/
W
R
W78C32C
Publication Release Date: July 1999
- 3 - Revision A2
PIN DESCRIPTION
P0.0
-
P0.7
Port 0, Bits 0 through 7. Port 0 is a bidirectional I/O port. This port also provides a multiplexed low
order address/data bus during accesses to external memory.
P1.0
-
P1.7
Port 1, Bits 0 through 7. Port 1 is a bidirectional I/O port with internal pull-ups. Pins P1.0 and P1.1
also serve as T2 (Timer 2 external input) and T2EX (Timer 2 capture/reload trigger), respectively.
P2.0
-
P2.7
Port 2, Bits 0 through 7. Port 2 is a bidirectional I/O port with internal pull-ups. This port also provides
the upper address bits for accesses to external memory.
P3.0
-
P3.7
Port 3, Bits 0 through 7. Port 3 is a bidirectional I/O port with internal pull-ups. All bits have alternate
functions, which are described below:
PIN
ALTERNATE FUNCTION
P3.0
RXD Serial Receive Data
P3.1
TXD Serial Transmit Data
P3.2
INT0 External Interrupt 0
P3.3
INT1 External Interrupt 1
P3.4
T0 Timer 0 Input
P3.5
T1 Timer 1 Input
P3.6
WR Data Write Strobe
P3.7
RD Data Read Strobe
EA
External Address Input, active low. This pin forces the processor to execute out of external ROM.
This pin should be kept low for all W78C32C operations.
RST
Reset Input, active high. This pin resets the processor. It must be kept high for at least two machine
cycles in order to be recognized by the processor.
ALE
Address Latch Enable Output, active high. ALE is used to enable the address latch that separates the
address from the data on Port 0. ALE runs at 1/6th of the oscillator frequency. A single ALE pulse is
skipped during external data memory accesses. ALE goes to a high state during reset with a weak
pull-up.
W78C32C
- 4 -
PSEN
Program Store Enable Output, active low.
PSEN
enables the external ROM onto the Port 0
address/data bus during fetch and MOVC operations.
PSEN
goes to a high state during reset with a
weak pull-up.
XTAL1
Crystal 1. This is the crystal oscillator input. This pin may be driven by an external clock.
XTAL2
Crystal 2. This is the crystal oscillator output. It is the inversion of XTAL1.
V
SS
, V
CC
Power Supplies. These are the chip ground and positive supplies.
BLOCK DIAGRAM
SFR
Port 0
Port 1
Port 2
CPU
Data Bus
Port 3
Alternate
Serial
Port
Timer 0
CORE
Interrupt
Timer 1
RAM
256
Bytes
Alternate
Timer 2
INT 1
INT 0
W78C32C
Publication Release Date: July 1999
- 5 - Revision A2
FUNCTIONAL DESCRIPTION
The W78C32C architecture consists of a core controller surrounded by various registers, four general
purpose I/O ports, 256 bytes of RAM, three timer/counters, and a serial port. The processor supports
111 different instruction and references both a 64K program address space and a 64K data storage
space.
Timers 0, 1, and 2
Timers 0, 1, and 2 each consist of two 8-bit data registers. These are called TL0 and TH0 for Timer 0,
TL1 and TH1 for Timer 1, and TL2 and TH2 for Timer 2. The TCON and TMOD registers provide
control functions for timers 0, 1. The T2CON register provides control functions for Timer 2. RCAP2H
and RCAP2L are used as reload/capture registers for Timer 2.
The operations of Timer 0 and Timer 1 are the same as in the W78C31. Timer 2 is a special feature
of the
W78C32C: it is a 16-bit timer/counter that is configured and controlled by the T2CON register.
Like Timers 0 and 1, Timer 2 can operate as either an external event counter or as an internal timer,
depending on the setting of bit C/T2 in T2CON. Timer 2 has three operating modes: capture, auto-
reload, and baud rate generator. The clock speed at capture or auto-reload mode is the same as that
of Timers 0 and 1.
Clock
The W78C32C is designed to be used with either a crystal oscillator or an external clock. Internally,
the clock is divided by two before it is used. This makes the W78C32C relatively insensitive to duty
cycle variations in the clock.
Crystal Oscillator
The W78C32C incorporates a built-in crystal oscillator. To make the oscillator work, a crystal must be
connected across pins XTAL1 and XTAL2. In addition, a load capacitor must be connected from each
pin to ground, and a resistor must also be connected from XTAL1 to XTAL2 to provide a DC bias
when the crystal frequency is above 24 MHz.
External Clock
An external clock should be connected to pin XTAL1. Pin XTAL2 should be left unconnected. The
XTAL1 input is a CMOS-type input, as required by the crystal oscillator. As a result, the external clock
signal should have an input one level of greater than 3.5 volts.
Power Management
Idle Mode
The idle mode is entered by setting the IDL bit in the PCON register. In the idle mode, the internal
clock to the processor is stopped. The peripherals and the interrupt logic continue to be clocked. The
processor will exit idle mode when either an interrupt or a reset occurs.
Power-down Mode
When the PD bit of the PCON register is set, the processor enters the power-down mode. In this
mode all of the clocks, including the oscillator are stopped. The only way to exit power-down mode is
by a reset.
W78C32C
- 6 -
Reset
The external RESET signal is sampled at S5P2. To take effect, it must be held high for at least two
machine cycles while the oscillator is running.
An internal trigger circuit in the reset line is used to deglitch the reset line when the W78C32C is used
with an external RC network. The reset logic also has a special glitch removal circuit that ignores
glitches on the reset line.
During reset, the ports are initialized to FFH, the stack pointer to 07H, PCON (with the exception of
bit 4) to 00H, and all of the other SFR registers except SBUF to 00H. SBUF is not reset.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
MIN.
MAX.
UNIT
DC Power Supply
V
CC
-
V
SS
-0.3
+7.0
V
Input Voltage
V
IN
V
SS
-0.3
V
CC
+0.3
V
Operating Temperature
T
A
0
70
C
Storage Temperature
T
ST
-55
+150
C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of
the device.
DC CHARACTERISTICS
V
CC
-
V
SS
= 5V
10%, T
A
= 25
C, F
OSC
= 20 MHz unless otherwise specified.
PARAMETER
SYM.
TEST CONDITIONS
SPECIFICATION
UNIT
MIN.
TYP.
MAX.
Operating Voltage
V
DD
-
4.5
5
5.5
V
Operating Current
I
DD
No load
V
DD
= 5.5V
-
-
30
mA
Idle Current
I
IDLE
Idle mode
V
DD
= 5.5V
-
-
6
mA
Power Down Current
I
PWDN
Power-down mode
V
DD
= 5.5V
-
-
50
A
Input Current
P1, P3
I
IN1
V
DD
= 5.5V
V
IN
= 0V or V
DD
-75
-
+10
A
Input Current
RST
(*2)
I
IN2
V
DD
= 5.5V
V
IN
= V
DD
-
+184
+350
A
Input Leakage Current
P0
(*1)
I
LK
V
DD
= 5.5V
0V<V
IN
<V
DD
-10
-
+10
A
Output Low Voltage
P1, P2
(*1)
, P3
V
OL1
V
DD
= 4.5V
I
OL1
= +2 mA
-
-
0.45
V
Output Low Voltage
ALE, PSEN , P0
(*1)
V
OL2
V
DD
= 4.5V
I
OL2
= +4 mA
-
-
0.45
V
W78C32C
Publication Release Date: July 1999
- 7 - Revision A2
DC Characteristics, continued
PARAMETER
SYM.
TEST CONDITIONS
SPECIFICATION
UNIT
MIN. TYP.
MAX.
Output High Voltage
P1, P3
V
OH1
V
DD
= 4.5V
I
OH1
= -100
A
2.4
-
-
V
Output High Voltage
ALE, PSEN , P0
(*1)
, P2
(*1)
V
OH2
V
DD
= 4.5V
I
OH2
= -400
A
2.4
-
-
V
Input Low Voltage
P1, P3
V
IL1
V
DD
= 4.5V
0
-
0.8
V
Input Low Voltage
XTAL1, RST
(*3)
V
IL2
V
DD
= 4.5V
0
-
0.8
V
Input High Voltage
P1, P3
V
IH1
V
DD
= 5.5V
2.4
-
V
DD
+0.2
V
Input High Voltage
XTAL1, RST
(*3)
V
IH2
V
DD
= 5.5V
3.5
-
V
DD
+0.2
V
Notes:
1. P0 and P2 are in external access mode.
2. RST pin has an internal pull-down resistor of about 30K
.
3. XTAL1 is a CMOS input and RST is a Schmitt trigger input.
AC CHARACTERISTICS
The AC specifications are a function of the particular process used to manufacture the part, the
ratings of the I/O buffers, the capacitive load, and the internal routing capacitance. Most of the
specifications can be expressed in terms of multiple input clock periods (T
CP
), and actual parts will
usually experience less than a
20 nS variation. The numbers below represent the performance
expected from a 0.5 micron CMOS process when using 2 and 4 mA output buffers.
Clock Input Waveform
T
T
XTAL1
F
CH
CL
OP,
T
CP
PARAMETER
SYMBOL
MIN.
TYP. MAX.
UNIT
NOTES
Operating Speed
F
OP
0
-
40
MHz
1
Clock Period
T
CP
25
-
-
nS
2
Clock High
T
CH
10
-
-
nS
3
Clock Low
T
CL
10
-
-
nS
3
Notes:
1. The clock may be stopped indefinitely in either state.
2. The T
CP
specification is used as a reference in other specifications.
3. There are no duty cycle requirements on the XTAL1 input.
W78C32C
- 8 -
Program Fetch Cycle
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
NOTES
Address Valid to ALE Low
T
AAS
1 T
CP
-
-
-
nS
4
Address Hold after ALE Low
T
AAH
1 T
CP
-
-
-
nS
1, 4
ALE Low to PSEN Low
T
APL
1 T
CP
-
-
-
nS
4
PSEN Low to Data Valid
T
PDA
-
-
2 T
CP
nS
2
Data Hold after PSEN High
T
PDH
0
-
1 T
CP
nS
3
Data Float after PSEN High
T
PDZ
0
-
1 T
CP
nS
ALE Pulse Width
T
ALW
2 T
CP
-
2 T
CP
-
nS
4
PSEN
Pulse Width
T
PSW
3 T
CP
-
3 T
CP
-
nS
4
Notes:
1. P0.0
-
P0.7, P2.0
-
P2.7 remain stable throughout entire memory cycle.
2. Memory access time is 3 T
CP
.
3. Data have been latched internally prior to PSEN going high.
4. "
" ( due to buffer driving delay and wire loading) is 20 nS.
Data Read Cycle
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
NOTE
S
ALE Low to RD Low
T
DAR
3 T
CP
-
-
3 T
CP+
nS
1, 2
RD Low to Data Valid
T
DDA
-
-
4 T
CP
nS
1
Data Hold after RD High
T
DDH
0
-
2 T
CP
nS
Data Float after RD High
T
DDZ
0
-
2 T
CP
nS
RD Pulse Width
T
DRD
6 T
CP
-
6 T
CP
-
nS
2
Notes:
1. Data memory access time is 8 T
CP
.
2. "
" (due to buffer driving delay and wire loading) is 20 nS.
Data Write Cycle
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
ALE Low to WR Low
T
DAW
3 T
CP
-
-
3 T
CP+
nS
Data Valid to WR Low
T
DAD
1 T
CP
-
-
-
nS
Data Hold from WR High
T
DWD
1 T
CP
-
-
-
nS
WR Pulse Width
T
DWR
6 T
CP
-
6 T
CP
-
nS
Note: "
" ( due to buffer driving delay and wire loading) is 20 nS.
W78C32C
Publication Release Date: July 1999
- 9 - Revision A2
Port Access Cycle
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Port Input Setup to ALE Low
T
PDS
1 T
CP
-
-
nS
Port Input Hold from ALE Low
T
PDH
0
-
-
nS
Port Output to ALE
T
PDA
1 T
CP
-
-
nS
Note: Ports are read during S5P2, and output data becomes available at the end of S6P2. The timing data are referenced to
ALE, since it provides a convenient reference.
TIMING WAVEFORMS
Program Fetch Cycle
S1
XTAL1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
ALE
PORT 2
A0-A7
A0-A7
Data
A0-A7
Code
T
A0-A7
Data
Code
PORT 0
PSEN
PDH,
T
PDZ
T
PDA
T
AAH
T
AAS
T
PSW
T
APL
T
ALW
Data Read Cycle
S2
S3
S5
S6
S1
S2
S3
S4
S5
S6
S1
S4
XTAL1
ALE
PSEN
DATA
A8-A15
PORT 2
PORT 0
A0-A7
RD
T
DDH,
T
DDZ
T
DDA
T
DRD
T
DAR
W78C32C
- 10 -
Timing Waveforms, continued
Data Write Cycle
S2
S3
S5
S6
S1
S2
S3
S4
S1
S5
S6
S4
XTAL1
ALE
PSEN
A8-A15
DATA OUT
PORT 2
PORT 0
A0-A7
WR
T
T
DAW
DAD
T
DWR
T
DWD
Port Access Cycle
XTAL1
ALE
S5
S6
S1
DATA OUT
T
T
PORT
INPUT
T
SAMPLE
PDA
PDH
PDS
W78C32C
Publication Release Date: July 1999
- 11 - Revision A2
TYPICAL APPLICATION CIRCUIT
Using External Program Memory and Crystal
AD0
A0
A0
A0
10
A1
9
A2
8
A3
7
A4
6
A5
5
A6
4
A7
3
A8
25
A9
24
A10
21
A11
23
A12
2
A13
26
A14
27
A15
1
CE
20
OE
22
O0
11
O1
12
O2
13
O3
15
O4
16
O5
17
O6
18
O7
19
27512
AD0
D0
3
Q0
2
D1
4
Q1
5
D2
7
Q2
6
D3
8
Q3
9
D4
13
Q4
12
D5
14
Q5
15
D6
17
Q6
16
D7
18
Q7
19
OC
1
G
11
74LS373
AD0
EA
31
XTAL1
19
XTAL2
18
RST
9
INT0
12
INT1
13
T0
14
T1
15
P1.0
1
P1.1
2
P1.2
3
P1.3
4
P1.4
5
P1.5
6
P1.6
7
P1.7
8
39
38
37
36
35
34
33
32
17
WR
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
RD
16
PSEN
29
ALE
30
TXD
11
RXD
10
W78C32C
10 u
8.2 K
V
CRYSTAL
C1
C2
R
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD1
AD2
AD3
AD4
AD5
AD6
AD7
GND
A1
A2
A3
A4
A5
A6
A7
A1
A2
A3
A4
A5
A6
A7
A8
A9
AD1
AD2
AD3
AD4
AD5
AD6
AD7
A10
A11
A12
A13
A14
A15
GND
21
22
23
24
25
26
27
28
A8
A9
A10
A11
A12
A13
A14
A15
CC
Figure A
CRYSTAL
C1
C2
R
16 MHz
30P
30P
-
24 MHz
15P
15P
-
33 MHz
10P
10P
6.8K
40 MHz
5P
5P
6.8K
Above table shows the reference values for crystal applications.
Note: C1, C2, R components refer to Figure A.
W78C32C
- 12 -
Expanded External Data Memory and Oscillator
10 u
8.2 K
V
OSCILLATOR
EA
31
XTAL1
19
XTAL2
18
RST
9
INT0
12
INT1
13
T0
14
T1
15
P1.0
1
P1.1
2
P1.2
3
P1.3
4
P1.4
5
P1.5
6
P1.6
7
P1.7
8
P0.0
39
P0.1
38
P0.2
37
P0.3
36
P0.4
35
P0.5
34
P0.6
33
P0.7
32
P2.0
21
P2.1
22
P2.2
23
P2.3
24
P2.4
25
P2.5
26
P2.6
27
P2.7
28
RD
17
WR
16
PSEN
29
ALE
30
TXD
11
RXD
10
W78C32C
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
A0
A1
A2
A3
A4
A5
A6
A7
D0
3
Q0
2
D1
4
Q1
5
D2
7
Q2
6
D3
8
Q3
9
D4
13
Q4
12
D5
14
Q5
15
D6
17
Q6
16
D7
18
Q7
19
OC
1
G
11
74LS373
A0
A1
A2
A3
A4
A5
A6
A7
10
9
8
7
6
5
4
3
A0
A1
A2
A3
A4
A5
A6
A7
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
11
12
13
15
16
17
18
19
D0
D1
D2
D3
D4
D5
D6
D7
A8
A9
A10
A11
A12
A13
A14
25
24
21
23
26
1
20
2
A8
A9
A10
A11
A12
A13
A14
CE
GND
A8
A9
A10
A11
A12
A13
A14
GND
22
27
OE
WR
20256
CC
Figure B
W78C32C
Publication Release Date: July 1999
- 13 - Revision A2
PACKAGE DIMENSIONS
40-pin DIP
Seating Plane
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
6. General appearance spec. should be based on
final visual inspection spec.
.
1.372
1.219
0.054
0.048
Notes:
Symbol
Min. Nom.
Max.
Max.
Nom.
Min.
Dimension in inch
Dimension in mm
0.050
1.27
0.210
5.334
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.406
0.254
3.937
0.457
4.064
0.559
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.203
3.048
0.254
3.302
0.356
3.556
0.540
0.550
0.545
13.72
13.97
13.84
17.01
15.24
14.986
15.494
0.600
0.590
0.610
2.286
2.54
2.794
0.090
0.100
0.110
A
B
c
D
e
A
L
S
A
A
1
2
E
B
1
1
e
E
1
a
2.055
2.070
52.20
52.58
0
15
0.090
2.286
0.650
0.630
16.00
16.51
protrusion/intrusion.
4. Dimension B1 does not include dambar
5. Controlling dimension: Inches.
15
0
e
A
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
40
21
20
1
2
44-pin PLCC
44
40
39
29
28
18
17
7
6
1
L
c
1
b
2
A
H
D
D
e
b
E
H
E
y
A
A
1
Seating Plane
D
G
G
E
Symbol
Min.
Nom.
Max.
Max.
Nom.
Min.
Dimension in inch
Dimension in mm
A
e
H
E
L
y
b
c
D
A
A
1
2
E
b
1
H
D
G
G
D
E
Notes:
on final visual inspection spec.
4. General appearance spec. should be based
3. Controlling dimension: Inches
protrusion/intrusion.
2. Dimension b1 does not include dambar
flash.
1. Dimension D & E do not include interlead
0.020
0.145
0.026
0.016
0.008
0.648
0.590
0.680
0.090
0.150
0.028
0.018
0.010
0.653
0.610
0.690
0.100
0.050
BSC
0.185
0.155
0.032
0.022
0.014
0.658
0.630
0.700
0.110
0.004
0.508
3.683
0.66
0.406
0.203
16.46
14.99
17.27
2.296
3.81
0.711
0.457
0.254
16.59
15.49
17.53
2.54
1.27
4.699
3.937
0.813
0.559
0.356
16.71
16.00
17.78
2.794
0.10
BSC
16.71
16.59
16.46
0.658
0.653
0.648
16.00
15.49
14.99
0.630
0.610
0.590
17.78
17.53
17.27
0.700
0.690
0.680
W78C32C
- 14 -
Package Dimensions, continued
44-pin QFP
Seating Plane
11
22
12
See Detail F
e
b
A
y
1
A
A
L
L
1
c
E
E
H
1
D
44
H
D
34
33
Detail F
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeter
4. General appearance spec. should be based
on final visual inspection spec.
0.254
0.101
0.010
0.004
Notes:
Symbol
Min.
Nom.
Max.
Max.
Nom.
Min.
Dimension in inch
Dimension in mm
A
b
c
D
e
H
D
H
E
L
y
A
A
L
1
1
2
E
0.006
0.152
---
0.002
0.075
0.01
0.081
0.014
0.087
0.018
1.90
0.25
0.05
2.05
0.35
2.20
0.45
0.390
0.025
0.063
0.003
0
7
0.394
0.031
0.398
0.037
9.9
0.80
0.65
1.6
10.00
0.8
10.1
0.95
0.398
0.394
0.390
0.530
0.520
0.510
13.45
13.2
12.95
10.1
10.00
9.9
7
0
0.08
0.031
0.01
0.02
0.25
0.5
---
---
---
---
---
2
0.025
0.036
0.635
0.952
0.530
0.520
0.510
13.45
13.2
12.95
0.051
0.075
1.295
1.905
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792766
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Note: All data and specifications are subject to change without notice.
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