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Электронный компонент: W83194AR-73

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W83194AR-73
150MHZ CLOCK FOR WHITNEY CHIPSET
Publication Release Date: May 1999
- 1 - Revision 0.40
1.0 GENERAL DESCRIPTION
The W83194AR-73 is a Clock Synthesizer for Intel Whitney chipset. W83194AR-73 provides all
clocks required for high-speed RISC or CISC microprocessor and also provides 32 different
frequencies of CPU, SDRAM, PCI, 3V66, IOAPIC clocks frequency setting. All clocks are externally
selectable with smooth transitions.
The W83194AR-73 provides I
2
C serial bus interface to program the registers to enable or disable
each clock outputs and provides 0.25% center and 0-0.5% down type spread spectrum to reduce EMI.
The W83194AR-73 accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply.
High drive PCI and SDRAM CLOCK outputs typically provide greater than 1 V /ns slew rate into 30
pF loads. CPU CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF loads as
maintaining 50
5% duty cycle. The fixed frequency outputs as REF, 24MHz, and 48 MHz provide
better than 0.5V /ns slew rate.
1.0 PRODUCT FEATURES
2 CPU clocks
9 SDRAM clocks for 2 DIMMs
8 PCI synchronous clocks.
Optional single or mixed supply:
(VDDR = VDDP=VDDS = VDD48 = VDD3 = 3.3V, VDDA=VDDC=2.5V)
Skew form CPU to PCI clock -1 to 4 ns, center 2.6 ns
Smooth frequency switch with selections from 66.8 to 150MHz
I
2
C 2-Wire serial interface and I
2
C read back
0.25% center and 0-0.5% down type spread spectrum
Programmable registers to enable/stop each output and select modes
(mode as Tri-state or Normal )
48 MHz for USB
24 MHz for super I/O
Packaged in 48-pin SSOP
W83194AR-73
PRELIMINARY
Publication Release Date: May 1999
- 2 - Revision 0.30
3.0 PIN CONFIGURATION
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
VDDR
VSS
Xin
Xout
VDD3
PCICLK0/ *FS0
VSS
PCICLK6
PCICLK2/*SEL24_48#
PCICLK3
PCICLK4
SDRAM_F
VSS
3V66-0
VDDP
PD#
*SDATA
*SDCLK
VddA
IOAPIC
VSS
REF1/*SEL_3V66
CPUCLK0
VDDC
CPUCLK1
VSS
SDRAM 0
SDRAM 1
SDRAM 2
VDDS
SDRAM 3
VSS
SDRAM 4
SDRAM 5
SDRAM 6
SDRAM 7
VSS
VDDS
48MHz-1/ *FS3
24_48MHz/ *FS2
PCICLK5
VDD48
VSS
3V66-1
VDDP
PCICLK1/ *FS1
PCICLK7
48MHz-0
W83194AR-73
PRELIMINARY
Publication Release Date: May 1999
- 3 - Revision 0.30
4.0 FREQUENCY SELECTION BY HARDWARE
FS3 FS2 FS1 FS0 CPU(MHz)
SDRAM
(MHz)
3V66 (MHz)
PCI(MHz)
IOAPIC
(MHz)
SEL_3V66=0
SEL_3V66=1
0
0
0
0
100.23
100.23
66.82
66.82
33.41
16.71
0
0
0
1
100.9
100.9
67.26
67.26
33.63
16.815
0
0
1
0
105
105
70
70
35
17.5
0
0
1
1
66.89
100.33
66.89
66.89
33.44
16.72
0
1
0
0
120
120
64
80
40
20.00
0
1
0
1
124
124
64
82.66
41.33
20.67
0
1
1
0
133.3
133.3
66.65
88.86
44.43
22.22
0
1
1
1
133.6
100.2
66.65
66.65
33.32
16.66
1
0
0
0
140
140
70
70
35
17.5
1
0
0
1
150
150
64
75
37.50
18.75
1
0
1
0
114.99
114.99
64
76.66
38.33
19.17
1
0
1
1
70
105
70
70
35
17.5
1
1
0
0
75
112.5
64
75
37.5
18.75
1
1
0
1
83.31
124.96
64
83.31
41.65
20.825
1
1
1
0
90
90
60
60
30
15
1
1
1
1
95
95
63.33
63.33
31.67
15.84
5.0
SERIAL CONTROL REGISTERS
The Pin column lists the affected pin number and the @PowerUp column gives the state at true
power up. Registers are set to the values shown only on true power up. "Command Code" byte and
"Byte Count" byte must be sent following the acknowledge of the Address Byte. Although the data
(bits) in these two bytes are considered "don't care", they must be sent and will be acknowledge.
After that, the below described sequence (Register 0, Register 1, Register 2, ....) will be valid and
acknowledged.
W83194AR-73
PRELIMINARY
Publication Release Date: May 1999
- 4 - Revision 0.30
5.1 Register 0: CPU Frequency Select Register
Bit
@PowerUp
Pin
Description
7
0
-
0 =
0.25% Center type Spread Spectrum Modulation
1 = 0~ 0.5% Down type
Spread Spectrum Modulation
6
0
-
SSEL2 ( Frequency table selection by software via I
2
C)
5
0
-
SSEL1 ( Frequency table selection by software via I
2
C)
4
0
-
SSEL0 ( Frequency table selection by software via I
2
C)
3
0
-
0 = Selection by hardware
1 = Selection by software I
2
C - Bit (2, 6:4),
Register1 Bit1
2
0
-
SSEL3 (Frequency table selection by software via I
2
C )
1
0
-
0 = Normal
1 = Spread Spectrum enabled
0
0
-
0 =
Running
1 = Tristate all outputs
5.2 Register 1 : CPU Clock Register (1 = Active, 0 = Inactive)
Bit
@PowerUp
Pin
Description
7
X
-
FS3#
6
X
-
FS0#
5
X
-
FS2#
4
1
28
24_48MHz(Active / Inactive)
3
1
27
48MHz-0(Active / Inactive)
2
1
26
48MHz-1(Active / Inactive)
1
1
-
SEL_3V66(Frequency table selection by software via I
2
C )
0
1
31
SDRAM_F(Active / Inactive)
5.3 Register 2: SDRAM Clock Register (1 = Active, 0 = Inactive)
Bit
@PowerUp
Pin
Description
7
1
32
SDRAM7 (Active / Inactive)
6
1
33
SDRAM6 (Active / Inactive)
5
1
35
SDRAM5 (Active / Inactive)
4
1
36
SDRAM4 (Active / Inactive)
3
1
37
SDRAM3 (Active / Inactive)
2
1
39
SDRAM2 (Active / Inactive)
1
1
40
SDRAM1 (Active / Inactive)
0
1
41
SDRAM0 (Active / Inactive)
W83194AR-73
PRELIMINARY
Publication Release Date: May 1999
- 5 - Revision 0.30
5.4 Register 3: PCI Clock Register (1 = Active, 0 = Inactive)
Bit
@PowerUp
Pin
Description
7
1
20
PCICLK7 (Active / Inactive)
6
1
19
PCICLK6 (Active / Inactive)
5
1
17
PCICLK5 (Active / Inactive)
4
1
16
PCICLK4 (Active / Inactive)
3
1
15
PCICLK3 (Active / Inactive)
2
1
13
PCICLK2 (Active / Inactive)
1
1
12
PCICLK1 (Active / Inactive)
0
1
11
PCICLK0 (Active / Inactive)
5.5 Register 4: Additional Register (1 = Active, 0 = Inactive)
Bit
@PowerUp
Pin
Description
7
X
-
SEL_3V66#
6
1
8
3V66_1(Active / Inactive)
5
1
7
3V66_0(Active / Inactive)
4
0
-
Reserve
3
1
47
IOAPIC (Active / Inactive)
2
X
-
FS1#
1
1
44
CPUCLK1(Active / Inactive)
0
1
45
CPUCLK0(Active / Inactive)
5.6 Register 5: Reserve Register
Bit
@PowerUp
Pin
Description
7
0
-
Reserve
6
0
-
Reserve
5
0
-
Reserve
4
0
-
Reserve
3
0
-
Reserve
2
0
-
Reserve
1
0
-
Reserve
0
0
-
Reserve
W83194AR-73
PRELIMINARY
Publication Release Date: May 1999
- 6 - Revision 0.30
5.7 Register 6: Winbond Chip ID Register (Read Only)
Bit
@PowerUp
Pin
Description
7
1
-
Winbond Chip ID
6
0
-
Winbond Chip ID
5
0
-
Winbond Chip ID
4
1
-
Winbond Chip ID
3
0
-
Winbond Chip ID
2
0
-
Winbond Chip ID
1
1
-
Winbond Chip ID
0
0
-
Winbond Chip ID
5.8 Register 7: Winbond Chip ID Register (Read Only)
Bit
@PowerUp
Pin
Description
7
0
-
Winbond Chip ID
6
0
-
Winbond Chip ID
5
0
-
Winbond Chip ID
4
0
-
Winbond Chip ID
3
0
-
Winbond Chip ID
2
0
-
Winbond Chip ID
1
1
-
Winbond Chip ID
0
0
-
Winbond Chip ID
W83194AR-73
PRELIMINARY
Publication Release Date: May 1999
- 7 - Revision 0.30
6.0 SPECIFICATIONS
6.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Subjection to maximum conditions for extended periods may affect reliability.
Unused inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
Symbol
Parameter
Rating
Vdd , V
IN
Voltage on any pin with respect to GND
- 0.5 V to + 7.0 V
T
STG
Storage Temperature
- 65
C to + 150
C
T
B
Ambient Temperature
- 55
C to + 125
C
T
A
Operating Temperature
0
C to + 70
C
6.2 AC CHARACTERISTICS
VddR=Vdd3=VddP=VddS=3.3V
5 %, VddC = VddA= 2.375V~2.9V , T
A
= 0
C to +70
C
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions
Output Duty Cycle
45
50
55
%
Measured at 1.5V
CPU/SDRAM to PCI Offset
t
OFF
1
4
ns
15 pF Load Measured at 1.5V
Skew (CPU-CPU), (PCI-
PCI), (SDRAM-SDRAM)
t
SKEW
250
ps
15 pF Load Measured at 1.5V
CPU/SDRAM
Cycle to Cycle Jitter
t
CCJ
250
ps
CPU/SDRAM
Absolute Jitter
t
JA
500
ps
Jitter Spectrum 20 dB
Bandwidth from Center
BW
J
500
KHz
Output Rise (0.4V ~ 2.0V)
& Fall (2.0V ~0.4V) Time
t
TLH
t
THL
0.4
1.6
ns
15 pF Load on CPU and PCI
outputs
Overshoot/Undershoot
Beyond Power Rails
V
over
0.7
1.5
V
22
at source of 8 inch PCB
run to 15 pF load
Ring Back Exclusion
V
RBE
0.7
2.1
V
Ring Back must not enter this
range.
W83194AR-73
PRELIMINARY
Publication Release Date: May 1999
- 8 - Revision 0.30
6.3 DC CHARACTERISTICS
VddR=Vdd3=VddP=VddS=3.3V
5 %, VddC = VddA= 2.375V~2.9V , T
A
= 0
C to +70
C
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions
Input Low Voltage
V
IL
Vss-
0.3
0.8
V
dc
Input High Voltage
V
IH
2.0
Vdd
+0.3
V
dc
Input Low Current
(no pull-up Resistors)
I
IL
-5
2.0
A
Input Low Current
(pull-up Resistors)
I
IL
-200
-100
A
Input High Current
I
IH
-5
5
A
Operating Current
I
DD
60
100
mA
@66M
Power Down Current
I
DDPD
400
600
A
C
L
= 0pF
Input Frequency
Fi
14.318
MHz
Vdd=3.3V
Pin Inductance
Lpin
7
nH
Input Capacitance
C
IN
5
pF
Logic Inputs
C
OUT
6
pF
Output pins capacitance
C
INX
13.5
22.5
pF
X1 & X2 pins
Transition Time
T
Tra
3
mS
Disable/Enable Delay
T
1
10
nS
Clock stabilization
T
STA
3
mS
W83194AR-73
PRELIMINARY
Publication Release Date: May 1999
- 9 - Revision 0.30
7.0 ORDERING INFORMATION
Part Number
Package Type
Production Flow
W83194AR-73
48 PIN SSOP
Commercial, 0
C to +70
C
8.0 HOW TO READ THE TOP MARKING
1st line: Winbond logo and the type number: W83194AR-73
2nd line: Tracking code 2 8051234
2: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 814 G B B
814: packages made in '98, week 14
G: assembly house ID; A means ASE, S means SPIL, G means GR
BB: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to their
respective owners
.
W83194AR-73
28051234
814GBB
W83194AR-73
PRELIMINARY
Publication Release Date: May 1999
- 10 - Revision 0.30
9.0 PACKAGE DRAWING AND DIMENSIONS
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Please note that all data and specifications are subject to change without notice. All the trade
marks of products and companies mentioned in this data sheet belong to their respective
owners
.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal injury.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sale.