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Электронный компонент: W83194R-81

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W83194R-81
100MHZ CLOCK FOR SIS CHIPSET
Publication Release Date: Dec. 1998
- 1 - Revision 0.20
1.0 GENERAL DESCRIPTION
The W83194R-81 is a Clock Synthesizer for SiS chipset. W83194R-81 provides all clocks required
for high-speed RISC or CISC microprocessor such as AMD,Cyrix,Intel Pentium and also provides 16
different frequencies of CPU clocks frequency setting. All clocks are externally selectable with
smooth transitions. The W83194R-81 makes SDRAM in synchronous or asynchronous frequency
with CPU clocks.
The W83194R-81 provides I
2
C serial bus interface to program the registers to enable or disable each
clock outputs and W83194R-81 provides the 0.25%, 0.5% center type spread spectrum to reduce
EMI.
The W83194R-81 accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply.
High drive PCI and SDRAM CLOCK outputs typically provide greater than 1 V /ns slew rate into 30
pF loads. CPU CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF loads as
maintaining 50
5% duty cycle. The fixed frequency outputs as REF, 24MHz, and 48 MHz provide
better than 0.5V /ns slew rate.
2.0 PRODUCT FEATURES
Supports Pentium
TM
, Pentium
TM
Pro, AMD and Cyrix CPUs with I
2
C.
3 CPU clocks
13 SDRAM clocks for 3 DIMMs
6 PCI synchronous clocks.
Optional single or mixed supply:
(Vdd = Vddq4=Vddq3 = Vddq2b = 3.3V, Vddq2=2.5V) or
(Vdd = Vddq4=Vddq3 = 3.3V, Vddq2=Vdq2b = 2.5V)
Skew form CPU to PCI clock -1 to 4 ns, center 2.6 ns
SDRAM frequency synchronous or asynchronous to CPU clocks
Smooth frequency switch with selections from 66 to 133mhz(including 90MHz)
I
2
C 2-Wire serial interface and I
2
C read back
0.25%, 0.5% center type spread spectrum to reduce EMI
Programmable registers to enable/stop each output and select modes
(mode as Tri-state or Normal )
MODE pin for power Management
48 MHz for USB
24 MHz for super I/O
48-pin SSOP package
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 2 - Revision 0.20
3.0 BLOCK DIAGRAM
PLL2
XTAL
OSC
Spread
Spectrum
PLL1
LATCH
POR
STOP
2
Contro
l Logic
Config
. Reg.
STOP
PCI
clock
Divder
5
13
5
48MHz
SIO
REF(0:2)
CPUCLK(0:2)
SDRAM(0:12)
PCICLK(0:4)
PCICLK_F
Xin
Xout
*FS(0:2) 3
*MODE
CPU_STOP#
PCI_STOP#
*SDAT
A*SCLK
3
3
CPU3.3_2.5#
CPU_STOP#
PCI_STOP#
*SD_SEL#
SEL24_14#
SDRAM_STOP#
PD#
IOAPIC
4.0 PIN CONFIGURATION
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Vdd
REF0/ *MODE
Vss
Xin
Xout
Vddq4
PCICLK_F/ *FS1
PCICLK0/ *FS2
Vss
PCICLK1
PCICLK2
PCICLK3
PCICLK4
Vddq4
SDRAM12
Vss
*CPU_STOP#/SDRAM11
*PCI_STOP#/SDRAM10
Vddq3
*SDRAM_STOP#/SDRAM 9
*PD#/SDRAM 8
Vss
*SDATA
*SDCLK
Vddq2
IOAPIC
REF1/ *SD_SEL#
Vss
REF2/CPU3.3_2.5#
CPUCLK0
Vddq2b
CPUCLK1
CPUCLK
2
Vss
SDRAM 0
SDRAM 1
SDRAM 2
Vddq3
SDRAM 3
Vss
SDRAM 4
SDRAM 5
SDRAM 6
SDRAM 7
Vss
Vddq3
48MHz/*FS0
SIO/*SEL24_14#
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 3 - Revision 0.20
5.0 PIN DESCRIPTION
IN - Input
OUT - Output
I/O - Bi-directional Pin
# - Active Low
* - Internal 250k
pull-up
5.1 Crystal I/O
SYMBOL
PIN
I/O
FUNCTION
Xin
4
IN
Crystal input with internal loading capacitors and
feedback resistors.
Xout
5
OUT
Crystal output at 14.318MHz nominally.
5.2 CPU, SDRAM, PCI Clock Outputs
SYMBOL
PIN
I/O
FUNCTION
CPUCLK [ 0:2 ]
40,41,43
OUT
Low skew (< 250ps) clock outputs for host
frequencies such as CPU, Chipset and Cache.
Vddq2b is the supply voltage for these outputs.
SDRAM11/
*CPU_STOP#
17
I/O
If MODE =1 (default), then this pin is a SDRAM clock
buffered output of the crystal. If MODE = 0 , then this
pin is CPU_STOP# input used in power
management mode for synchronously stopping the
all CPU clocks.
SDRAM10/
*PCI_STOP#
18
I/O
If MODE = 1 (default), then this pin is a SDRAM
clock output. If MODE = 0 , then this pin is
PCI_STOP # and used in power management mode
for synchronously stopping the all PCI clocks.
SDRAM9/
*SDRAM_STOP#
20
I/O
If MODE = 1 (default), then this pin is a SDRAM
clock output. If MODE = 0 , then this pin is
SDRAM_STOP # and used in power management
mode for stopping the all SDRAM clocks.
SDRAM8/ *PD#
21
I/O
If MODE = 1 (default), then this pin is a SDRAM
clock output. If MODE = 0 , then this pin is PD # and
used to power down the device into a power down
state.
SDRAM[0:7],
SDRAM12
28,29,31,32,34
, 35,37,38,15
O
SDRAM clock outputs which have the same
frequency as CPU clocks.
PCICLK_F/ *FS1
7
I/O
Latched input for FS1 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
Free running PCI clock during normal operation.
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 4 - Revision 0.20
5.2 CPU, SDRAM, PCI Clock Outputs, continued
SYMBOL
PIN
I/O
FUNCTION
PCICLK 0 / *FS2
8
I/O
Latched input for FS2 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
PCI clock during normal operation.
PCICLK [ 1:4 ]
10,11,12,13
OUT
Low skew (< 250ps) PCI clock outputs.
5.3 I
2
C Control Interface
SYMBOL
PIN
I/O
FUNCTION
*SDATA
23
I/O
Serial data of I
2
C 2-wire control interface
*SDCLK
24
IN
Serial clock of I
2
C 2-wire control interface
5.4 Fixed Frequency Outputs
SYMBOL
PIN
I/O
FUNCTION
IOAPIC
47
O
2.5V fixed 14.318MHz
REF0 / *MODE
2
I/O
3.3V, 14.318MHz reference clock output.
Internal 250k
pull-up.
Function select pin.
REF1 /*SD_SEL#
46
I/O
3.3V, 14.318MHz reference clock output
Internal 250k
pull-up.
Latched input at Power On selects the frequencies
for clock outputs.
REF2 / CPU3.3#_2.5
44
I/O
Internal 250k
pull-up.
Latched input for CPU3.3#_2.5 at initial power up.
Reference clock during normal operation.
Latched high - Vddq2b = 2.5V
Latched low - Vddq2b = 3.3V
SIO / *SEL24_14#
25
I/O
*SEL24_14# controls the frequency of SIO. If logic 0
at power on, SIO=14.318. If logic 1, SIO=24MHz for
super I/O.
48MHz / *FS0
26
I/O
Internal 250k
pull-up.
Latched input for FS0 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks. 48MHz output for USB during normal
operation.
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 5 - Revision 0.20
5.5 Power Pins
SYMBOL
PIN
FUNCTION
Vdd
1
Power supply for REF0 crystal and core logic.
Vddq2
48
Power supply for REF1,IOAPIC output, 2.5V.
Vddq2b
42
Power supply for REF2, CPUCLK[0:2], either 2.5V or
3.3V.
Vddq3
19, 30, 36
Power supply for SDRAM and 48/24MHz outputs.
Vddq4
6,14
Power supply for PCICLK outputs.
Vss
3,9,16,22,27,
33,39,45
Circuit Ground.
6.0 FREQUENCY SELECTION BY HARDWARE
SD_SEL
FS2
FS1
FS0
CPU
(MHz)
SDRAM
(MHz)
PCI
(MHz)
REF (MHz)
IOAPIC
0
0
0
0
66.70
100.05
33.35
14.318
0
0
0
1
90
90
30
14.318
0
0
1
0
95.25
63.4
31.7
14.318
0
0
1
1
100.2
66.8
33.4
14.318
0
1
0
0
100
75
30
14.318
0
1
0
1
112
74.7
37.3
14.318
0
1
1
0
124
82.7
31
14.318
0
1
1
1
133.3
88.9
33.3
14.318
1
0
0
0
66.8
66.8
33.4
14.318
1
0
0
1
75
75
30
14.318
1
0
1
0
83.3
83.3
33.32
14.318
1
0
1
1
95.25
95.25
31.7
14.318
1
1
0
0
100.2
100.2
33.4
14.318
1
1
0
1
112
112
37.3
14.318
1
1
1
0
124
124
31
14.318
1
1
1
1
133.3
133.3
33.3
14.318
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 6 - Revision 0.20
7.0 CPU 3.3#_2.5 BUFFER SELECTION
CPU 3.3#_2.5 ( Pin 44 ) Input Level
CPU Operate at
1
VDD = 2.5V
0
VDD = 3.3V
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 7 - Revision 0.20
8.0 FUNTION DESCRIPTION
8.1 POWER MANAGEMENT FUNCTIONS
All clocks can be individually enabled or disabled via the 2-wire control interface. On power up,
external circuitry should allow 3 ms for the VCO
to stabilize prior to enabling clock outputs to
assure correct pulse widths. When MODE=0, pins 17, 18, 20 and 21 are inputs (PCI_STOP#),
(CPU_STOP#), (SDRAM_STOP#), (PD#). when MODE=1, these functions are not available. A
particular clock could be enabled as both the 2-wire serial control interface and one of these pins
indicate that it should be enabled.
The W83194R-81 may be disabled in the low state according to the following table in order to reduce
power consumption. All clocks are stopped in the low state, but maintain a valid high period on
transitions from running to stop. The CPU and PCI clocks transform between running and stop by
waiting for one positive edge on PCICLK_F followed by negative edge on the clock of interest, after
which high levels of the output are either enabled or disabled.
MODE PIN-POWER MANAGEMENT INPUT
MODE(Pin2)
Pin17
Pin18
Pin20
Pin21
0 (Input)
CPU_STOP#
PCI_STOP#
SDRAM_STOP#
PD#
1 (Output)
SDRAM11
SDRAM10
SDRAM9
SDRAM8
PD#
CPU_STOP#
PCI_STOP#
SDRAM
_STOP#
PCI [0:4]
SDRAM
[0:12]
CPU[1:2]
XTAL &
VCOs
0
X
X
X
Low
Low
Low
Low
1
X
X
X
Running
Running
Running
Running
1
1
1
1
Running
Running
Running
Running
1
1
1
0
Running
Running
Running
Running
1
1
0
1
Low
Running
Running
Running
1
1
0
0
Low
Low
Running
Running
1
0
1
1
Running
Running
Low
Running
1
0
1
0
Running
Low
Low
Running
1
0
0
1
Low
Running
Low
Running
1
0
0
0
Low
Low
Low
Running
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 8 - Revision 0.20
8.2 2-WIRE I
2
C CONTROL INTERFACE
The clock generator is a slave I2C component which can be read
back the data stored in the latches
for verification. All proceeding bytes must be sent to change one of the control bytes. The 2-wire
control interface allows each clock output individually enabled or disabled. On power up, the
W83194R-81 initializes with default register settings, and then it optional to use the 2-wire control
interface.
The SDATA signal only changes when the SDCLK signal is low, and is stable when SDCLK is high
during normal data transfer. There are only two exceptions. One is a high-to-low transition on
SDATA while SDCLK is high used to indicate the beginning of a data transfer cycle. The other is a
low-to-high transition on SDATA while SDCLK is high used to indicate the end of a data transfer
cycle. Data is always sent as complete 8-bit bytes followed by an acknowledge generated.
Byte writing starts with a start condition followed by 7-bit slave address [1101 0010], command code
checking [0000 0000], and byte count checking. After successful reception of each byte, an
acknowledge (low) on the SDATA wire will be generated by the clock chip. Controller can start to
write to internal I
2
C registers after the string of data. The sequence order is as follows:
Bytes sequence order for I
2
C controller :
Clock Address
A(6:0) & R/W
Ack
8 bits dummy
Command code
Ack
8 bits dummy
Byte count
Ack
Byte0,1,2...
until Stop
Set R/W to 1 when read back the data sequence is as follows, [1101 0011] :
Clock Address
A(6:0) & R/W
Ack
Byte 0
Ack
Ack
Byte2, 3, 4...
until Stop
Byte 1
8.3 SERIAL CONTROL REGISTERS
The Pin column lists the affected pin number and the @PowerUp column gives the state at true
power up. Registers are set to the values shown only on true power up. "Command Code" byte and
"Byte Count" byte must be sent following the acknowledge of the Address Byte. Although the data
(bits) in these two bytes are considered "don't care", they must be sent and will be acknowledge.
After that, the below described sequence (Register 0, Register 1, Register 2, ....) will be valid and
acknowledged.
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 9 - Revision 0.20
8.3.1 Register 0: CPU Frequency Select Register
Bit
@PowerUp
Pin
Description
7
0
-
0 =
0.25% Spread Spectrum Modulation
1 =
0.5% Spread Spectrum Modulation
6
0
-
SSEL2 ( Frequency table selection by software via I
2
C)
5
0
-
SSEL1 ( Frequency table selection by software via I
2
C)
4
0
-
SSEL0 ( Frequency table selection by software via I
2
C)
3
0
-
0 = Selection by hardware
1 = Selection by software I
2
C - Bit 6:4 and Bit2
2
0
-
SSEL3 (Frequency table selection by software via I
2
C )
1
0
-
0 = Normal
1 = Spread Spectrum enabled
0
0
-
0 =
Running
1 = Tristate all outputs
Frequency table selection by software via I
2
C
SSEL3
SSEL2
SSEL1
SSEL0
CPU
(MHz)
SDRAM
(MHz)
PCI
(MHz)
REF (MHz)
IOAPIC
0
0
0
0
66.70
100.05
33.35
14.318
0
0
0
1
90
90
30
14.318
0
0
1
0
95.25
63.4
31.7
14.318
0
0
1
1
100.2
66.8
33.4
14.318
0
1
0
0
100
75
30
14.318
0
1
0
1
112
74.7
37.3
14.318
0
1
1
0
124
82.7
31
14.318
0
1
1
1
133.3
88.9
33.3
14.318
1
0
0
0
66.8
66.8
33.4
14.318
1
0
0
1
75
75
30
14.318
1
0
1
0
83.3
83.3
33.32
14.318
1
0
1
1
95.25
95.25
31.7
14.318
1
1
0
0
100.2
100.2
33.4
14.318
1
1
0
1
112
112
37.3
14.318
1
1
1
0
124
124
31
14.318
1
1
1
1
133.3
133.3
33.3
14.318
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 10 - Revision 0.20
8.3.2 Register 1 : CPU Clock Register (1 = Active, 0 = Inactive)
Bit
@PowerUp
Pin
Description
7
1
-
Reserved
6
1
-
Reserved
5
1
-
Reserved
4
1
-
Reserved
3
1
40
CPUCLK2 (Active / Inactive)
2
1
41
CPUCLK1 (Active / Inactive)
1
1
43
CPUCLK0 (Active / Inactive)
0
-
-
Latched FS0#
8.3.3 Register 2: PCI Clock Register (1 = Active, 0 = Inactive)
Bit
@PowerUp
Pin
Description
7
-
-
Latched FS1#
6
1
7
PCICLK_F (Active / Inactive)
5
1
-
Reserved
4
1
13
PCICLK4 (Active / Inactive)
3
1
12
PCICLK3 (Active / Inactive)
2
1
11
PCICLK2 (Active / Inactive)
1
1
10
PCICLK1 (Active / Inactive)
0
1
8
PCICLK0 (Active / Inactive)
8.3.4 Register 3: SDRAM Clock Register (1 = Active, 0 = Inactive)
Bit
@PowerUp
Pin
Description
7
1
28
SDRAM7 (Active / Inactive)
6
1
29
SDRAM6 (Active / Inactive)
5
1
31
SDRAM5 (Active / Inactive)
4
1
32
SDRAM4 (Active / Inactive)
3
1
34
SDRAM3 (Active / Inactive)
2
1
35
SDRAM2 (Active / Inactive)
1
1
37
SDRAM1 (Active / Inactive)
0
1
38
SDRAM0 (Active / Inactive)
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 11 - Revision 0.20
8.3.5 Register 4: Additional SDRAM Clock Register (1 = Active, 0 = Inactive)
Bit
@PowerUp
Pin
Description
7
1
-
Reserved
6
1
25
24/14MHz(Active / Inactive)
5
1
26
48MHz(Active / Inactive)
4
1
15
SDRAM12 (Active / Inactive)
3
1
17
SDRAM11 (Active / Inactive)
2
1
18
SDRAM10 (Active / Inactive)
1
1
20
SDRAM9 (Active / Inactive)
0
1
21
SDRAM8 (Active / Inactive)
8.3.6 Register 5: Peripheral Control (1 = Active, 0 = Inactive)
Bit
@PowerUp
Pin
Description
7
1
-
Reserved
6
-
-
Latched FS2#
5
1
-
Reserved
4
1
47
IOAPIC (Active / Inactive)
3
-
-
Latched SD_SEL
2
1
44
REF2 (Active / Inactive)
1
1
46
REF1 (Active / Inactive)
0
1
2
REF0 (Active / Inactive)
8.3.7 Register 6: Winbond Chip ID Register (Read Only)
Bit
@PowerUp
Pin
Description
7
0
-
Winbond Chip ID
6
1
-
Winbond Chip ID
5
0
-
Winbond Chip ID
4
1
-
Winbond Chip ID
3
0
-
Winbond Chip ID
2
1
-
Winbond Chip ID
1
0
-
Winbond Chip ID
0
0
-
Winbond Chip ID
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 12 - Revision 0.20
9.0 SPECIFICATIONS
9.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused
inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
Symbol
Parameter
Rating
Vdd , V
IN
Voltage on any pin with respect to GND
- 0.5 V to + 7.0 V
T
STG
Storage Temperature
- 65
C to + 150
C
T
B
Ambient Temperature
- 55
C to + 125
C
T
A
Operating Temperature
0
C to + 70
C
9.2 AC CHARACTERISTICS
Vddq4 = Vdd = Vddq3 = 3.3V
5 %, Vddq2=Vddq2b = 2.375V~2.9V , T
A
= 0
C to +70
C
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions
Output Duty Cycle
45
50
55
%
Measured at 1.5V
CPU/SDRAM to PCI Offset
t
OFF
1
4
ns
15 pF Load Measured at 1.5V
Skew (CPU-CPU), (PCI-
PCI), (SDRAM-SDRAM)
t
SKEW
250
ps
15 pF Load Measured at 1.5V
CPU/SDRAM
Cycle to Cycle Jitter
t
CCJ
250
ps
CPU/SDRAM
Absolute Jitter
t
JA
500
ps
Jitter Spectrum 20 dB
Bandwidth from Center
BW
J
500
KHz
Output Rise (0.4V ~ 2.0V)
& Fall (2.0V ~0.4V) Time
t
TLH
t
THL
0.4
1.6
ns
15 pF Load on CPU and PCI
outputs
Overshoot/Undershoot
Beyond Power Rails
V
over
1.5
V
22
at source of 8 inch PCB
run to 15 pF load
Ring Back Exclusion
V
RBE
2.1
V
Ring Back must not enter this
range.
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 13 - Revision 0.20
9.3 DC CHARACTERISTICS
Vddq4 = Vdd = Vddq3 = 3.3V
5 %, Vddq2=Vddq2b = 2.375V~2.9V , T
A
= 0
C to +70
C
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions
Input Low Voltage
V
IL
0.8
V
dc
Input High Voltage
V
IH
2.0
V
dc
Input Low Current
I
IL
-66
A
Input High Current
I
IH
5
A
Output Low Voltage
I
OL
= 4 mA
V
OL
0.4
V
dc
All outputs
Output High Voltage
I
OH
= 4mA
V
OH
2.4
V
dc
All outputs using 3.3V power
Tri-State leakage Current
Ioz
10
A
Dynamic Supply Current
for Vdd + Vddq3
I
dd3
mA
CPU = 66.6 MHz
PCI = 33.3 Mhz with load
Dynamic Supply Current
for Vddq2 + Vddq2b
I
dd2
mA
Same as above
CPU Stop Current
for Vdd + Vddq3
I
CPUS3
mA
Same as above
CPU Stop Current
for Vddq2 + Vddq2b
I
CPUS2
mA
Same as above
PCI Stop Current
for Vdd + Vddq3
I
PD3
mA
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 14 - Revision 0.20
9.4 BUFFER CHARACTERISTICS
9.4.1 TYPE 1 BUFFER FOR CPU (0:2)
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions
Pull-Up Current Min
I
OH(min)
-27
mA
Vout = 1.0 V
Pull-Up Current Max
I
OH(max)
-27
mA
Vout = 2.0V
Pull-Down Current Min
I
OL(min)
mA
Vout = 1.2 V
Pull-Down Current Max
I
OL(max)
27
mA
Vout = 0.3 V
Rise/Fall Time Min
Between 0.4 V and 2.0 V
T
RF(min)
0.4
ns
10 pF Load
Rise/Fall Time Max
Between 0.4 V and 2.0 V
T
RF(max)
1.6
ns
20 pF Load
9.4.2 TYPE 2 BUFFER FOR IOAPIC
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions
Pull-Up Current Min
I
OH(min)
mA
Vout = 1.4 V
Pull-Up Current Max
I
OH(max)
-29
mA
Vout = 2.7V
Pull-Down Current Min
I
OL(min)
mA
Vout = 1.0 V
Pull-Down Current Max
I
OL(max)
28
mA
Vout = 0.2 V
Rise/Fall Time Min
Between 0.7 V and 1.7 V
T
RF(min)
0.4
ns
10 pF Load
Rise/Fall Time Max
Between 0.7 V and 1.7 V
T
RF(max)
1.8
ns
20 pF Load
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 15 - Revision 0.20
9.4.3 TYPE 3 BUFFER FOR REF(0:2), 24MHZ, 48MHZ
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions
Pull-Up Current Min
I
OH(min)
-29
mA
Vout = 1.0 V
Pull-Up Current Max
I
OH(max)
-23
mA
Vout = 3.135V
Pull-Down Current Min
I
OL(min)
29
mA
Vout = 1.95 V
Pull-Down Current Max
I
OL(max)
mA
Vout = 0.4 V
Rise/Fall Time Min
Between 0.8 V and 2.0 V
T
RF(min)
1.0
ns
10 pF Load
Rise/Fall Time Max
Between 0.8 V and 2.0 V
T
RF(max)
4.0
ns
20 pF Load
9.4.4 TYPE 4 BUFFER FOR SDRAM(0:12)
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions
Pull-Up Current Min
I
OH(min)
mA
Vout = 1.65V
Pull-Up Current Max
I
OH(max)
-46
mA
Vout = 3.135V
Pull-Down Current Min
I
OL(min)
mA
Vout = 1.65 V
Pull-Down Current Max
I
OL(max)
53
mA
Vout = 0.4 V
Rise/Fall Time Min
Between 0.8 V and 2.0 V
T
RF(min)
0.5
ns
20 pF Load
Rise/Fall Time Max
Between 0.8 V and 2.0 V
T
RF(max)
1.3
ns
30 pF Load
9.4.5 TYPE 5 BUFFER FOR PCICLK(0:4, F)
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions
Pull-Up Current Min
I
OH(min)
-33
mA
Vout = 1.0 V
Pull-Up Current Max
I
OH(max)
-33
mA
Vout = 3.135 V
Pull-Down Current Min
I
OL(min)
30
mA
Vout = 1.95 V
Pull-Down Current Max
I
OL(max)
38
mA
Vout = 0.4 V
Rise/Fall Time Min
Between 0.8 V and 2.0 V
T
RF(min)
0.5
ns
15 pF Load
Rise/Fall Time Max
Between 0.8 V and 2.0 V
T
RF(max)
2.0
ns
30 pF Load
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 16 - Revision 0.20
10.0 POWER MANAGEMENT TIMING
10.1 CPU_STOP# Timing Diagram
CPUCLK
(Internal)
PCICLK
(Internal)
PCICLK_F
CPU_STOP#
CPUCLK[0:3]
SDRAM
1
2
1
2
For synchronous Chipset, CPU_STOP# pin is a synchronous
"a
ctive low
"i
nput pin used to stop the
CPU clocks for low power operation. This pin is asserted synchronously by the external control logic
at the rising edge of free running PCI clock(PCICLK_F). All other clocks will continue to run while
the CPU clocks are stopped. The CPU clocks will always be stopped in a low state and resume
output with full pulse width. In this case, CPU
locks on latency
"
is less than 2 CPU clocks and
locks off latency is less then 2 CPU clocks.
10.2 PCI_STOP# Timing Diagram
CPUCLK
(Internal)
PCICLK
(Internal)
PCICLK_F
PCI_STOP#
PCICLK[0:4]
1
2
1
2
For synchronous Chipset, PCI_STOP# pin is a synchronous
ctive low
"
input pin used to stop the
PCICLK [0:4] for low power operation. This pin is asserted synchronously by the external control logic
at the rising edge of free running PCI clock(PCICLK_F). All other clocks will continue to run while
the PCI clocks are stopped. The PCI clocks will always be stopped in a low state and resume output
with full pulse width. In this case, PCI
locks on latency
"
is less than 1 PCI clocks and locks off
latency is less then 1 PCI clocks.
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 17 - Revision 0.20
11.0 ORDERING INFORMATION
Part Number
Package Type
Production Flow
W83194R-81
48 PIN SSOP
Commercial, 0
C to +70
C
12.0 HOW TO READ THE TOP MARKING
W83194R-81
28051234
814GBB
1st line: Winbond logo and the type number: W83194R-81
2nd line: Tracking code 2 8051234
2: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 814 G B B
814: packages made in '98, week 14
G: assembly house ID; A means ASE, S means SPIL, G means GR
BB: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to
their respective owners
.
W83194R-81
PRELIMINARY
Publication Release Date: Dec. 1998
- 18 - Revision 0.20
13.0 PACKAGE DRAWING AND DIMENSIONS
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their
respective owners
.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Winbond customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Winbond for any damages resulting
from such improper use or sale.