1
MF431
High Performance LED
Description
This device is designed for FDDI and ATM 155 Mbps
applications and offers an excellent price/
performance ratio for cost-effective solutions. Its
double-lens optical system results in optimum
coupling of power into the fiber.
DS5470
ISSUE 1
May 2001
Ordering Information
MF431
13429.11 TO-46 Package
MF431 ST
13324.11 ST Housing
MF431 SC
13591.11 SC Housing
MF431 SMA
13548.11 SMA Housing
MF431 FC
13549.11 FC Housing
Note: Rated Fiber coupled power apply only on the TO-46 package,
for housing options fiber coupled power is typically 10% less
Optical and Electrical Characteristics - Case temperature 25C
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition
Fiber-Coupled Power
(Fig. 1,2 & 3) (Table 1)
P
fiber
43
W
I
F
=60mA
(Note 1)
Fiber:
62.5/
125
m
Graded
Index
Rise and Fall Time
(10-90%)
t
r'
t
f
2.5
ns
I
F
=60mA
(no bias)
Bandwidth
(3dB
el
)
f
c
125
MHz
I
F
=60mA
Peak Center Wavelength
p
1320
nm
I
F
=60mA
Spectral Width (FWHM)
135
nm
I
F
=60mA
Forward Voltage (Fig. 5)
V
F
1.3
1.65
V
I
F
=60mA
Reverse Current
I
R
100
A
V
R
=1V
Capacitance
C
200
pF
V
R
=0V, f=1 MHz
Note 1: Measured at the exit of 100 meters of fiber
TO-46 Package with Lens
0.6
14
1.5
4.7
3.7
0.4
5.4
2.5
CASE
ANODE
CATHODE
BOTTOM VIEW
The diode chip is isolated from the case
All dimensions in mm
MF431
2
Absolute Maximum Ratings
Thermal Characteristics
Parameter
Symbol
Limit
Storage Temperature
T
stg
-55 to +125C
Operating Temperature see (derating: Fig. 4)
T
op
-40 to +85C
Electrical Power Dissipation (derating: Fig. 4)
P
tot
160 mW
Continuous Forward Current (f<10kHz)
I
F
80 mA
Peak Forward Current (duty cycle<50%, f>1MHz)
I
FRM
130 mA
Reverse Voltage
V
R
0.5V
Soldering Temperature (2mm from the case for 10sec)
T
sld
260C
Parameter
Symbol
Min.
Typ.
Max.
Unit
Thermal Resistance - Infinite Heat Sink
R
thjc
150
C/W
Thermal Resistance - No Heat Sink
R
thja
400
C/W
Temperature Coefficient - Optical Power
dP/dT
j
-0.75
%/C
Temperature Coefficient - Wavelength
/dT
j
0.45
nm/C
BOTTOM VIEW ( 10 : 1 )
SIDE VIEW
Zarlink Semiconductor 2002. All rights reserved.
ISSUE
ACN
DATE
APPRD.
Previous package codes
Title
Drawing type
Package code
1
JS004 076R1 A
22-MAR-03
TD/BE
JS004076
Package drawing, TO-46 with lens
TB
2,54
0,45
n
- 0,04
0,03
+
(3x)
1,17
n
- 0
0,05
+
(3x)
1,0
2
`
0,3
3,
6
45
R0,2 max (4x)
R2,7
4
,
7
n
0,6
3,8
13,46
`
0,76
Lens
n
1.5
`
0.05
R0,4 max
0,3 max glass overmould (2x)
NOTES:-
1. All dimensions in mm.
2. General tol. ISO-2768-mK.
3. Coating:
Case: Ni 1,5-2,5 m.
Header: Ni 2-3 m / Au min 1,32 m.
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