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Электронный компонент: MF436FC

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1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003, Zarlink Semiconductor Inc. All Rights Reserved.
Features
1310nm Surface-Emitting LED
50MHz Bandwidth
Designed for 62.5/125m fiber
High power
Applications
Sensors
Test Equipment
Signal transmission
Description
This device generates very high power which makes it
ideal for many sensors and signal transmission
applications. It operates in a wide range of
temperatures, and can satisfy virtually any
environmental specification. The double-lens optical
system results in optimum coupling of power into the
fiber.
October 2003
Ordering Information
MF436
TO-46 Package
MF436 ST
11 ST Housing
MF436 FC
SC Housing
-40
C to +85
C
Note: Rated Fiber coupled power apply only on the TO-46
package, for housing options fiber coupled power is
typically 10% less.
MF436
1300nm - 50MHz High Performance LED
Data Sheet
Figure 1 - Pin Diagram
Figure 2 - Functional Schematic
ANODE
CASE
Bottom View
CATHODE
ANODE
CATHODE
MF436
Data Sheet
2
Zarlink Semiconductor Inc.
Note 1: Measured at the exit of 100 meters of fiber.
Optical and Electrical Characteristics - Case Temperature 25
C
Parameter
Symbol
Min
Typ
Max
Unit
Test Condition
Fiber-Coupled Power
(Figures 3, 4 and 5) (Table 1)
P
fiber
20
27
W
I
F
=80mA, Note 1
Fiber: 50/125
m
NA=0.20
70
80
W
I
F
=80mA, Note 1
Fiber: 62.5/125
m
NA=0.275
Rise and Fall Time (10-90%)
t
r
,t
f
7
10
ns
I
F
=80mA (no bias)
Bandwidth (3dB
el
)
f
c
50
MHz
I
F
=80mA
Peak Wavelength
p
1270
1300
1350
nm
I
F
=80mA
Spectral Width (FWHM)
145
165
nm
I
F
=80mA
Forward Voltage (Figure 5)
V
F
1.5
2
V
I
F
=80mA
Reverse Current
I
R
100
A
V
R
=1V
Capacitance
C
200
pF
V
R
-0V, f=1MHz
Absolute Maximum Ratings
Parameter
Symbol
Limit
Storage Temperature
T
stg
-55 to +125
C
Operating Temperature
T
op
-40 to +85
C
Electrical Power Dissipation (Figure 4)
P
tot
160 mW
Continuous Forward Current (f<10kHz)
I
F
90 mA
Peak Forward Current (duty cycle<50%,f>1MHz
I
FRM
130 mA
Reverse Voltage
V
R
0.5 V
Soldering Temperature (2mm from the case for 10 sec.)
T
sld
260
C
Thermal Characteristics
Parameter
Symbol
Min
Typ
Max
Unit
Thermal Resistance - Infinite Heat Sink
R
thjc
150
C/W
Thermal Resistance - No Heat Sink
R
thja
450
C/W
Temperature Coefficient - Optical Power
dP/dT
j
-0.6
%/
C
Temperature Coefficient - Wavelength
d
/dT
j
0.45
nm/
C
Temperature Coefficient - Spectral Width
d
/dT
j
0.25
nm/
C
MF436
Data Sheet
3
Zarlink Semiconductor Inc.
Figure 3 - z - Axial Displacement of Fiber
Typical Fiber-Coupled Power
Core Diameter/Cladding Diameter Numerical Aperture
50/125
m
0.20
62.5/125
m
0.275
100/140
m
0.29
27
W
80
W
140
W
0
20
40
60
80
100
0.5
0.75
1
1.25
1.5
1.75
2
2.25
2.5
2.75
3
z - axial Displacement of Fiber (mm)
R
e
l
a
t
i
v
e
Fi
be
r-
c
oupl
e
d
Pow
e
r (
%
z
r
r - optimal
C
= 62.5
m
MF436
Data Sheet
4
Zarlink Semiconductor Inc.
Figure 4 - r - Radial Displacement of Fiber
Figure 5 - Relative Fiber-coupled Power vs. Forward Current
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
100
r - Radial Displacem ent of Fiber (



m )
Re
l
a
ti
v
e
Fi
be
r-c
oupl
e
d
P
o
w
e
r (%)
z
r
z - optimal
C
= 62.5
m
0
20
40
60
80
100
0
20
40
60
80
100
120
140
160
180
200
Forw ard Current (mA)
Re
l
a
ti
v
e
Fi
be
r-c
oupl
e
d
P
o
w
e
r (%)
50% Duty Cycle
Heat Sinked
DC
MF436
Data Sheet
5
Zarlink Semiconductor Inc.
Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature
Figure 7 - Forward Current vs. Forward Voltage
0
50
100
150
200
250
300
0
15
30
45
60
75
90
105
120
135
150
Operating Tem perature (
o
C)
M
ax. Elect
r
i
cal Po
wer
D
i
ssip
a
t
i
o
n
(
m
V)
No Heat Sink
Infinite
Heat Sink
0
25
50
75
100
125
150
175
200
0
0.25
0.5
0.75
1
1.25
1.5
1.75
2
2.25
2.5
2.75
3
Forw ard Voltage (V)
Forwa
rd C
u
rre
nt
(
m
A
)
BOTTOM VIEW ( 10 : 1 )
SIDE VIEW
Zarlink Semiconductor 2002. All rights reserved.
ISSUE
ACN
DATE
APPRD.
Previous package codes
Title
Drawing type
Package code
1
JS004 076R1 A
22-MAR-03
TD/BE
JS004076
Package drawing, TO-46 with lens
TB
2,54
0,45
n
- 0,04
0,03
+
(3x)
1,17
n
- 0
0,05
+
(3x)
1,0
2
`
0,3
3,
6
45
R0,2 max (4x)
R2,7
4
,
7
n
0,6
3,8
13,46
`
0,76
Lens
n
1.5
`
0.05
R0,4 max
0,3 max glass overmould (2x)
NOTES:-

1. All dimensions in mm.
2. General tol. ISO-2768-mK.
3. Coating:

Case: Ni 1,5-2,5 m.
Header: Ni 2-3 m / Au min 1,32 m.
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Purchase of Zarlink's I
2
C components conveys a licence under the Philips I
2
C Patent rights to use these components in an I
2
C System, provided that the system
conforms to the I
2
C Standard Specification as defined by Philips.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003, Zarlink Semiconductor Inc. All Rights Reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE
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