SUMMARY
V
(BR)DSS
= 100V; R
DS(ON)
= 0.4
I
D
= 1.9A
DESCRIPTION
This new generation of TRENCH MOSFETs from Zetex utilizes a unique structure
that combines the benefits of low on-resistance with fast switching speed. This
makes them ideal for high efficiency, low voltage, power management
applications.
FEATURES
Low on-resistance
Fast switching speed
Low threshold
Low gate drive
SOT89 package
APPLICATIONS
DC - DC Converters
Power Management Functions
Relay and solenoid driving
Motor control
DEVICE MARKING
7N6
ZXMN6A07Z
ISSUE 1 - MARCH 2002
1
60V N-CHANNEL ENHANCEMENT MODE MOSFET
DEVICE
REEL
SIZE
TAPE
WIDTH
QUANTITY
PER REEL
ZXMN6A07ZTA
7"
12mm
1000 units
ORDERING INFORMATION
Top View
SOT89
ZXMN6A07Z
ISSUE 1 - MARCH 2002
2
PARAMETER
SYMBOL
VALUE
UNIT
Junction to Ambient (a)
R
JA
83.3
C/W
Junction to Ambient (b)
R
JA
47.4
C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t 10 secs.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10 s - pulse width limited by maximum junction temperature. Refer to
transient Thermal Impedance graph
THERMAL RESISTANCE
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
VDSS
60
V
Gate Source Voltage
VGS
20
V
Continuous Drain Current VGS=10V; TA=25C (b)
VGS=10V; TA=70C (b)
VGS=10V; TA=25C (a)
ID
1.9
1.5
1.4
A
Pulsed Drain Current (c)
IDM
6
A
Continuous Source Current (Body Diode) (b)
IS
2.4
A
Pulsed Source Current (Body Diode) (c)
ISM
6
A
Power Dissipation at TA=25C (a)
Linear Derating Factor
PD
1.5
12
W
mW/C
Power Dissipation at TA=25C (b)
Linear Derating Factor
PD
2.6
21
W
mW/C
Operating and Storage Temperature Range
Tj:Tstg
-55 to +150
C
ABSOLUTE MAXIMUM RATINGS.
ZXMN6A07Z
ISSUE 1 - MARCH 2002
4
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT CONDITIONS.
STATIC
Drain-Source Breakdown Voltage
V(BR)DSS
60
V
ID=250 A, VGS=0V
Zero Gate Voltage Drain Current
IDSS
1.0
A
VDS=60V, VGS=0V
Gate-Body Leakage
IGSS
60
nA
VGS= 20V, VDS=0V
Gate-Source Threshold Voltage
VGS(th)
1.0
3.0
V
I
D
=250 A, VDS= VGS
Static Drain-Source On-State Resistance
(1)
RDS(on)
0.3
0.40
0.55
VGS=10V, ID=1.8A
VGS=4.5V, ID=1.3A
Forward Transconductance (1)(3)
gfs
2.3
S
VDS=15V,ID=1.8A
DYNAMIC (3)
Input Capacitance
Ciss
166
pF
VDS=40 V, VGS=0V,
f=1MHz
Output Capacitance
Coss
19.5
pF
Reverse Transfer Capacitance
Crss
8.7
pF
SWITCHING(2) (3)
Turn-On Delay Time
td(on)
1.8
ns
VDD =30V, ID=1.8A
RG=6.0 , VGS=10V
Rise Time
tr
1.4
ns
Turn-Off Delay Time
td(off)
4.9
ns
Fall Time
tf
2.0
ns
Gate Charge
Qg
1.65
nC
VDS = 30V, VGS =5V
ID= 1.8A
Total Gate Charge
Qg
3.2
nC
VDS=30V,VGS=10V,
ID=1.8A
Gate-Source Charge
Qgs
0.67
nC
Gate-Drain Charge
Qgd
0.82
nC
SOURCE-DRAIN DIODE
Diode Forward Voltage (1)
VSD
0.85
0.95
V
TJ=25C, IS=1.5A,
VGS=0V
Reverse Recovery Time (3)
trr
20.5
ns
TJ=25C, IF=1.0A,
di/dt= 100A/
s
Reverse Recovery Charge (3)
Qrr
21.3
nC
ELECTRICAL CHARACTERISTICS
(at T
A
= 25C unless otherwise stated).
NOTES
(1) Measured under pulsed conditions. Width
=
300
s. Duty cycle
2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
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