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Электронный компонент: U62H64SA

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December 12, 1997
1
U62H64SA
Description
The U62H64SA is a static RAM
manufactured using a CMOS pro-
cess technology with the following
operating modes:
- Read - Standby
- Write - Data Retention
The memory array is based on a
6-transistor cell.
The circuit is activated by the rising
edge of E2 (at E1 = L), or the falling
edge of E1 (at E2 = H). The
address and control inputs open
simultaneously.
According to the information of W
and G, the data inputs, or outputs,
are active. During the active state
(E1 = L and E2 = H), each address
change leads to a new Read or
Write cycle. In a Read cycle, the
data outputs are activated by the
falling edge of G, afterwards the
data word read will be available at
the outputs DQ0 - DQ7. After the
address change, the data outputs
go High-Z until the new read infor-
mation is available. The data out-
puts have no preferred state. If the
memory is driven by CMOS levels
in the active state, and if there is no
change of the address, data input
and control signals W or G, the ope-
rating current (at I
O
= 0 mA) drops to
the value of the operating current in
the Standby mode. The Read cycle
is finished by the falling edge of E2
or W, or by the rising edge of E1,
respectively.
Data retention is guaranteed down
to 2 V.
With the exception of E1 and E2, all
inputs consist of NOR gates, so that
no pull-up/pull-down resistors are
required. This gate circuit allows to
achieve low power standby require-
ments by activation with TTL-levels
too.
Features
F
Fast 8192 x 8 bit static CMOS RAM
F
35 ns Access Time
F
Bidirectional data inputs and data
outputs
F
Three-state outputs
F
Data retention current at 3 V:
< 50
A
F
Standby current < 100
A
F
TTL/CMOS-compatible
F
Automatic reduction of power
dissipation in long Read or Write
cycles
F
Power supply voltage 5 V
F
Operating temperature range
-40 to 125
C
F
Quality assessment according to
CECC 90000, CECC 90100 and
CECC 90111
F
ESD protection > 2000 V
(MIL STD 883C M3015.7)
F
Latch-up immunity > 200 mA
F
Package: SOP28 (300 mil)
Pin Description
Signal Name Signal Description
A0 - A12 Address Inputs
DQ0 - DQ7 Data In/Out
E1
Chip Enable 1
E2 Chip Enable 2
G
Output Enable
W
Write Enable
VCC Power Supply Voltage
VSS Ground
n.c. not connected
Pin Configuration
1
n.c.
VCC
28
2
A12
W (WE)
27
4
A6
A8
25
5
A5
A9
24
3
A7
E2 (CE2)
26
6
A4
A11
23
7
A3
G (OE)
22
8
A2
A10
21
12
DQ1
DQ5
17
9
A1
E1 (CE1)
20
10
A0
DQ7
19
11
DQ0
DQ6
18
13
DQ2
DQ4
16
14
VSS
DQ3
15
SOP
Top View
Automotive Fast 8K x 8 SRAM
December 12, 1997
2
U62H64SA
* H or L
Operating Mode E1
E2 W
G
DQ0 - DQ7
Standby/not
selected
* L * * High-Z
H * * * High-Z
Internal Read L H H H High-Z
Read L H H L Data Outputs
Low-Z
Write L H L * Data Inputs High-Z
Truth Table
Block Diagram
A0
A1
A2
A3
A4
A5
Memory Cell
Array
128 Rows
64 x 8 Columns
Bi
di
r
e
c
t
i
ona
l

D
a
t
a
I
/
O
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
* Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 s.
Maximum Ratings Symbol Min. Max. Unit
Power Supply Voltage V
CC
-0.3 7 V
Input Voltage V
I
-0.3 V
CC
+ 0.5 V
Output Voltage V
O
-0.3 V
CC
+ 0.5 V
Operating Temperature T
a
-40 125
C
Storage Temperature T
stg
-65 150
C
Output Short-Circuit Current
at V
CC
= 5 V and V
O
= 0 V
*
|I
OS
|
200
mA
E2
E1
Characteristics
V
CC
V
SS
W
G
R
o
w
Addr
es
s
I
nput
s
Ro
w De
c
o
d
e
r
Sense Amplifier/
Write Control Logic
Clock
Generator
C
o
l
u
m
n
Addr
es
s
I
nput
s
C
o
l
u
m
n
D
e
c
oder
Address
Change
Detector
A6
A7
A8
A9
A10
A11
A12
All voltages are referenced to V
SS
= 0 V (ground).
All characteristics are valid in the power supply voltage range and in the operating temperature range specified.
Dynamic measurements are based on a rise and fall time of
5 ns, measured between 10 % and 90 % of V
I
, as well as
input levels of V
IL
= 0 V and V
IH
= 3 V. The timing reference level of all input and output signals is 1.5 V,
with the exception of the t
dis
-times and t
en
-times, in which cases transition is measured
200 mV from steady-state voltage.
December 12, 1997
3
U62H64SA
Electrical Characteristics Symbol Conditions Min. Max. Unit
Supply Current - Operating Mode
Supply Current - Standby Mode
(CMOS level)
Supply Current - Standby Mode
(TTL level)
Supply Current - Data Retention
Mode
I
CC(OP)
I
CC(SB)
I
CC(SB)1
I
CC(DR)
V
CC
V
IL
V
IH
t
cW
V
CC
V
E1
= V
E2
V
CC
V
E1
= V
E2
V
CC(DR)
V
E1
= V
E2
= 5.5 V
= 0.8 V
= 2.2 V
=
35 ns
= 5.5 V
= V
CC
- 0.2 V
= 5.5 V
= 2.2 V
= 3.0 V
= V
CC(DR)
- 0.2 V
50
100
5
(typ. 2)
50
mA
A
mA
A
Output High Voltage
Output Low Voltage
V
OH
V
OL
V
CC
I
OH
V
CC
I
OL
= 4.5 V
= -4.0 mA
= 4.5 V
= 8.0 mA
2.4
-
-
0.4
V
V
Output High Current
Output Low Current
I
OH
I
OL
V
CC
V
OH
V
CC
V
OL
= 4.5 V
= 2.4 V
= 4.5 V
= 0.4 V
-
8.0
-4.0
-
mA
mA
Input High Leakage Current
Input Low Leakage Current
I
IH
I
IL
V
CC
V
IH
V
CC
V
IL
= 5.5 V
= 5.5 V
= 5.5 V
= 0 V
-
-2
2
-
A
A
Output Leakage Current
High at Three-State Outputs
Low at Three-State Outputs
I
OHZ
I
OLZ
V
CC
V
OH
V
CC
V
OL
= 5.5 V
= 5.5 V
= 5.5 V
=
0 V
-
-2
2
-
A
A
* -2 V at Pulse Width 10 ns or -1 V at Pulse Width 50 ns
Recommended
Operating Conditions
Symbol Conditions Min. Max. Unit
Power Supply Voltage V
CC
4.5 5.5 V
Data Retention Voltage V
CC(DR)
2.0
-
V
Input Low Voltage *
V
IL
-0.3 0.8 V
Input High Voltage V
IH
2.2 V
CC
+0.3 V
December 12, 1997
4
U62H64SA
Switching Characteristics
Symbol Min. Max. Unit
Alt. IEC 35 35
Time to Output in Low-Z from
E1 LO W or E2 HIGH
G LOW
W HIGH
t
LZCE
t
LZOE
t
LZWE
t
en(E)
t
en(G)
t
en(W)
5
0
0
ns
ns
ns
Cycle Time
Write Cycle Time
Read Cycle Time
t
WC
t
RC
t
cW
t
cR
35
35
ns
ns
Access Time
E1 LO W or E2 HIGH to Data Valid
G LOW to Data Valid
Address to Data Valid
t
ACE
t
OE
t
AA
t
a(E)
t
a(G)
t
a(A)
35
15
35
ns
ns
ns
Pulse Widths
Write Pulse Width
Chip Enable to End of Write
t
WP
t
CW
t
w(W)
t
w(E)
20
25
ns
ns
Setup Times
Address Setup Time
Chip Enable to End of Write
Write Pulse Width
Data Setup Time
t
AS
t
CW
t
WP
t
DS
t
su(A)
t
su(E)
t
su(W)
t
su(D)
0
25
20
15
ns
ns
ns
ns
Data Hold Time
Address Hold from End of Write
t
DH
t
AH
t
h(D)
t
h(A)
0
0
ns
ns
Output Hold Time from Address Change t
OH
t
v(A)
5
ns
E1 HIGH or E2 LOW to Output in High-Z
W LOW to Output in High-Z
G HIGH to Output in High-Z
t
HZCE
t
HZWE
t
HZOE
t
dis(E)
t
dis(W)
t
dis(G)
15
15
12
ns
ns
ns
E1 LOW or E2 HIGH to Power-Up t
PU
0
ns
E1 HIGH or E2 LO W to Power-Down t
PD
35 ns
Data Retention Mode E1-Controlled
Data Retention Mode E2-Controlled
4.5 V
V
CC
E1
V
CC(DR)
2 V
V
E2(DR)
V
CC(DR)
- 0.2 V or V
E2(DR)
0.2 V
V
CC(DR)
- 0.2 V
V
E1(DR)
V
CC(DR)
+ 0.3 V
0 V
0.8 V
0.8 V
4.5 V
0 V
V
CC
Chip Deselect to Data Retention Time t
DR
: min 0 ns
Operating Recovery Time at V
CC(DR)
t
rec
: min t
cR
V
E1(DR)
V
CC(DR)
- 0.2 V or V
E1(DR)
0.2 V
V
E2(DR)
0.2 V
t
rec
t
DR
Data Retention
2.2 V
2.2 V t
rec
t
DR
V
CC(DR)
2 V
Data Retention
E2
December 12, 1997
5
U62H64SA
Test Configuration for Functional Check
V
IH
V
IL
V
SS
V
CC
5 V
481
255
30 pF
1)
V
O
IC Code Number
Example
The date of manufacture is given by the last 4 digits of the mark, the first 2 digits indicating the year, and the last
2 digits the calendar week.
S
U62H64
35
A
Type
Package
S = SOP
Access Time
35 = 35 ns
Operating Temperature Range
A = -40 to 125 C
All pins not under test must be connected with ground by capacitors.
In
p
u
t
l
e
v
e
l
a
c
c
o
r
d
i
n
g
to
th
e
r
e
l
e
v
ant

t
e
s
t
m
eas
ur
em
ent
Si
m
u
l
t
aneou
s
m
eas
ur
e-
m
e
nt

of
a
l
l
8
out
put

pi
ns
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
E1
E2
W
G
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
Capacitance Conditions Symbol Min. Max. Unit
Input Capacitance
V
CC
= 5.0 V
V
I
= V
SS
C
I
8
pF
Output Capacitance
f = 1 MHz
T
a
= 25
C
C
O
10 pF
1)
In measurement of t
dis(E)
, t
dis(W)
, t
dis(G)
, t
en(E)
, t
en(W)
, t
en(G)
the capacitance is 5 pF.
December 12, 1997
6
U62H64SA
t
cR
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AAAA
AAAA
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AAAA
AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
High-Z
Addresses Valid
Read Cycle 2 (during Read cycle: W = V
IH
, G-, E1- or E2-controlled)
A
i
E1
E2
G
DQ
i
Output
t
dis(E)
t
su(A)
t
a(E)
t
su(A)
t
en(E)
t
en(E)
t
en(G)
t
a(G)
t
a(E)
t
dis(E)
t
dis(G)
Output Data
Valid
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAA
AAA
AAA
AAA
t
PD
*
t
PU
*
A
A
A
A
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AA
AA
A
A
A
A
AAAA
AAAA
AAAA
AAAA
AAA
AAA
I
CC(OP)
I
CC(SB)
t
h(D)
Read Cycle 1 (during Read cycle: E1 = G = V
IL
, E2 = W = V
IH
, A
i
-controlled)
Write Cycle 1 (W-controlled)
t
a(A)
Previous
Data Valid
Output Data
Valid
t
cR
Addresses Valid
t
v(A)
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AAA
A
i
DQ
i
Output
A
i
E1
E2
W
DQ
i
G
DQ
i
Output
t
cW
t
su(E)
t
h(A)
t
w(W)
t
su(A )
t
su(E)
t
su(D)
t
dis(W)
t
en(W)
Addresses Valid
High-Z
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AAAA
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AAA
AAA
AAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAA
AAA
AAA
AAA
Input
* The same applies to E1
50 %
50 %
AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAA
AAA
AAA
AAA
Input Data
Valid
December 12, 1997
7
U62H64SA
AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
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AAAA
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AAAA
AAAA
AAAA
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AAAA
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AAAA
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AAAA
AAAA
AAA
AAA
AAA
AAA
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AAAA
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AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAA
AAA
AAA
AAA
High-Z
I
nput Data
Valid
t
h(D)
t
su(W)
t
w(E)
t
su(D)
t
cW
Addresses Valid
t
su(A )
t
su(E)
t
h(A)
t
en(E)
t
dis(W)
AAAA
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AAAA
AAAA
AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AA
AA
AA
AA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
A
i
E1
E2
W
DQ
i
Input
G
DQ
i
Output
t
su(A )
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AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
undefined L- or H-level
Write Cycle 2 (E1-controlled)
Write Cycle 3 (E2-controlled)
t
h(D)
A
i
E1
E2
W
DQ
i
Input
G
DQ
i
Output
t
cW
t
w(E)
t
h(A)
t
su(W)
t
su(E)
t
su(D)
t
dis(W)
t
en(E)
Addresses Valid
Input Data
Valid
High-Z
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AAA
AAA
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AAAA
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AAAA
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AAAA
AAAA
AAAA
AAAA
AAAA
AAA
AAA
AAA
AAA
LIFE SUPPORT POLICY
ZMD products are not designed, intended, or authorized for use as components in
systems intend for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the ZMD
product could create a situation where personal injury or death may occur.
Components used in life-support devices or systems must be expressly authorized
by ZMD for such purpose.
The information describes the type of component and shall not be considered as
assured characteristics.
Terms of delivery and rights to change design reserved.
Memory Products 1998
Automotive Fast 8K x 8 SRAM U62H64SA
Zentrum Mikroelektronik Dresden GmbH
Grenzstrae 28
D-01109 Dresden
P.
O.
B. 80
01
34
D-01101 Dresden
Germany
Phone: +49 351 88 22-3 06 Fax: +49 351 88 22-3 37 Email: sales@zmd.de
Internet Web Site: http://www.zmd.de