Preliminary
Tech. Notes Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005
Page 1 of 4
ZMD AG, 2005
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31010
RBic
Lite
TM
Low-Cost Sensor Signal Conditioner
Technical Notes Die Dimensions and Pad Coordinates PRELIMINARY
ZMD31010 RBic
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TM Technical Notes
Die Dimensions and Pad Coordinates
Contents
1
RBIC
LITE
TM DIE DIMENSIONS..................................................................................................................... 2
2
RBIC
LITE
TM PAD COORDINATES ............................................................................................................... 3
3
RELATED DOCUMENTS............................................................................................................................ 4
Preliminary
Tech. Notes Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005
Page 2 of 4
ZMD AG, 2005
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31010
RBic
Lite
TM
Low-Cost Sensor Signal Conditioner
Technical Notes Die Dimensions and Pad Coordinates PRELIMINARY
1 RBic
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TM Die Dimensions
Die size (including scribeline): 2230 m x 1681 m 3.75sqmm
Core die size (without scribeline): 2080 m x 1531 m 3.19 sqmm
Die thickness: 390m
Scribeline (distance between two core dice on wafer): 150m
Pads size: 68m x 68m
Preliminary
Tech. Notes Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005
Page 3 of 4
ZMD AG, 2005
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31010
RBic
Lite
TM
Low-Cost Sensor Signal Conditioner
Technical Notes Die Dimensions and Pad Coordinates PRELIMINARY
2 RBic
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TM Pad Coordinates
All pads coordinates are for pad centers and related to the corner.
Name
X Coordinate in
Y Coordinate in
bsink 106.3
85.9
por_n 1109.7
85.9
vbp 1210.0
85.9
vdd 1389.3
77.3
vbn 1568.1
85.9
vss 107.2
1444.7
vssa 198.3
1444.7
vpp 356.1
1444.7
sig_pd 1428.6
1444.7
vdd 1672.3
1435.8
vgate 1809.2
1444.7
Preliminary
Tech. Notes Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005
Page 4 of 4
ZMD AG, 2005
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31010
RBic
Lite
TM
Low-Cost Sensor Signal Conditioner
Technical Notes Die Dimensions and Pad Coordinates PRELIMINARY
3 Related
Documents
ZMD31010 RBic
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TM
Datasheet
ZMD31010 RBic
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TM
Development Kit Documentation
ZMD31010 RBic
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TM
Errata Sheet
ZMD31010 RBic
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TM
Application Notes In-Circuit Programming Boards
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