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Электронный компонент: ZMD31050AC

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Copyright 2003, ZMD AG, Rev. 0.6.2, 2003-11-18, PRELIMINARY
1/23
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31050 RB
IC
series
Advanced Differential Sensor Signal Conditioner
Datasheet
PRELIMINARY
Features
Digital compensation of sensor offset, sensitivity,
temperature drift and non-linearity
Accommodates nearly all bridge sensors by PGA
and programmable ADC
Capable with sensor signals from 1 up to
275mV/V span
Sensor connections check and aging detection
Selectable temperature compensation reference:
bridge, thermistor, internal diode or external diode
Output options: voltage (0...5V), current
(4...20mA), PWM, I
2
C, SPI, ZACwire
TM
(one-wire-
interface), alarm
Adjustable output resolution (up to 15 bits) versus
sampling rate (up to 3.9kHz)
Selectable bridge excitation: ratiometric voltage,
constant voltage or constant current
Input channel for separate temperature sensor
Operation temperature -40...+125C
(-50...+150C derated)
Supply voltage +2.7V...+5.5V
Available in SSOP16 or as die
Benefits
No external trimming components required
PC-controlled configuration and calibration via
digital bus interface - simple, low cost
High accuracy (0.1% FSO @ -25...85C; 0.25%
FSO @ -40...125C)
Brief Description
The ZMD31050 is a CMOS integrated circuit that
belongs to ZMD's RB
IC
series. It performs highly-
accurate amplification/scaling and sensor-specific
correction of bridge sensor signals.
Digital compensation of sensor offset, sensitivity,
temperature drift and non-linearity is accomplished via
a 16-bit RISC micro-controller running a correction
algorithm with calibration coefficients stored in non-
volatile EEPROM.

The ZMD31050 accommodates virtually any bridge
sensor (e.g. piezo-resistive, ceramic-thickfilm or steel
membrane based). In addition, the IC can interface a
separate temperature sensor.

The bi-directional digital interfaces (I
2
C, SPI,
ZACwire
TM
) can be used for a simple PC-controlled
calibration, in order to program a set of calibration
coefficients into an on-chip EEPROM. Thus a specific
sensor and a ZMD31050 are mated digitally: fast,
precise and without the cost overhead associated with
laser trimming, or mechanical potentiometer methods.
Application kit available (SSOP16 samples,
calibration PCB, calibration software, technical
documentation)
Support for industrial mass calibration
available
Quick circuit customization possible for large
production volumes
Application Circuit (Examples)

Fig.1: Ratiometric measurement with voltage output,
temperature compensation via external diode
Fig.2: Two wire 4...20mA (5...40V) configuration.
Temperature compensation via internal diode
Copyright 2003, ZMD AG, Rev. 0.6.2, 2003-11-18, PRELIMINARY
2/23
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31050 RB
IC
series
Advanced Differential Sensor Signal Conditioner
Datasheet
PRELIMINARY
Contents
1.
CIRCUIT DESCRIPTION ..............................................................................................................3
1.1
S
IGNAL
F
LOW
..............................................................................................................................3
1.2
A
PPLICATION
M
ODES
...................................................................................................................4
1.3
A
NALOG
F
RONT
E
ND
(AFE) .........................................................................................................5
1.3.1.
Programmable Gain Amplifier .............................................................................................5
1.3.2.
Measurement Cycle Realized by Multiplexer ......................................................................5
1.3.3.
Analog Offset Compensation ..............................................................................................6
1.3.4.
Analog-to-Digital Converter .................................................................................................6
1.4
S
YSTEM
C
ONTROL
.......................................................................................................................8
1.5
O
UTPUT
S
TAGE
...........................................................................................................................9
1.5.1.
Serial Digital Interface .......................................................................................................10
1.5.2.
ZACwire
TM
Single Wire Digital Interface............................................................................10
1.5.3.
Analog Output ...................................................................................................................12
1.5.4.
Comparator Module (ALARM Output) ...............................................................................13
1.6
V
OLTAGE
R
EGULATOR
...............................................................................................................13
1.7
E
RROR
D
ETECTION
...................................................................................................................14
2.
APPLICATION CIRCUIT EXAMPLES........................................................................................15
3.
ESD/LATCH-UP-PROTECTION.................................................................................................15
4.
PIN CONFIGURATION AND PACKAGE ...................................................................................16
5.
IC CHARACTERISTICS .............................................................................................................17
5.1
A
BSOLUTE
M
AXIMUM
R
ATINGS
...................................................................................................17
5.2
O
PERATING
C
ONDITIONS
(V
OLTAGES RELATED TO
VSS) ........................................................17
5.3
B
UILD
I
N
C
HARACTERISTICS
.......................................................................................................18
5.3.8 Cycle Rate versus A/D-Resolution ........................................................................................19
5.3.9 PWM Frequency....................................................................................................................19
5.4
E
LECTRICAL
P
ARAMETERS
(V
OLTAGES RELATED TO
VSS)......................................................20
5.5
I
NTERFACE
C
HARACTERISTICS
...................................................................................................21
6.
TEST ...........................................................................................................................................22
7.
RELIABILITY ..............................................................................................................................22
8.
CUSTOMIZATION ......................................................................................................................22
9.
RELATED DOCUMENTS ...........................................................................................................22
10.
ORDERING INFORMATION.......................................................................................................23
Copyright 2003, ZMD AG, Rev. 0.6.2, 2003-11-18, PRELIMINARY
3/23
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31050 RB
IC
series
Advanced Differential Sensor Signal Conditioner
Datasheet
PRELIMINARY
1. Circuit
Description
1.1 Signal
Flow
Fig.3: Block diagram of ZMD31050
PGA
programmable gain amplifier
MUX
multiplexer
ADC
analog-to-digital
converter
CMC
calibration
microcontroller
DAC
digital-to-analog
converter
FIO1
flexible I/O 1: analog out (voltage/current), PWM2,
ZACwire
TM
(one-wire-interface)
FIO2
flexible I/O 2: PWM1, SPI data out, SPI slave select, Alarm1, Alarm2
SIF
serial interface: I2C data I/O, SPI data in, clock
PCOMP programmable
comparator
EEPROM
for calibration parameters and configuration
TS
on-chip temperature sensor (pn-junction)
ROM
for correction formula and algorithm
PWM
PWM
module

The ZMD31050's signal path is partly analog (blue) and partly digital (red).
The differential signal from the bridge sensor is pre-amplified by the programmable gain amplifier
(PGA). The Multiplexer (MUX) transmits the signals from bridge sensor, external diode or separate
temperature sensor to the ADC in a certain sequence (instead of the temp. diode the internal pn-
junction (TS) can be used optionally). Afterwards the ADC converts these signals into digital values.
The digital signal correction takes place in the calibration micro-controller (CMC). It is based on a
special correction formula located in the ROM and on sensor-specific coefficients (stored into the
EEPROM during calibration).
Copyright 2003, ZMD AG, Rev. 0.6.2, 2003-11-18, PRELIMINARY
4/23
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31050 RB
IC
series
Advanced Differential Sensor Signal Conditioner
Datasheet
PRELIMINARY
Dependent on the programmed output configuration the corrected sensor signal is output as analog
value, as PWM signal or in digital format (SPI, I
2
C,
ZACwire
TM
). The output signal is provided at 2
flexible I/O modules (FIO) and at the serial interface (SIF). The configuration data and the correction
parameters can be programmed into the EEPROM via the digital interfaces.
The modular circuit concept enables fast custom designs varying these blocks and, as a result,
functionality and die size.
1.2 Application
Modes

For each application a configuration set has to be established (generally prior to calibration) by
programming the on-chip EEPROM regarding to the following modes:
Sensor channel
- Sensor mode: ratiometric voltage or current supply mode.
- Input range: The gain of the analog front end has to be chosen with respect to the maximum
sensor signal span and the zero point of the ADC has to be set with respect to the possible input
voltage range
- Additional offset compensation: The extended analog offset compensation has to be enabled if
required, e.g. if the sensor offset voltage is near to or larger than the sensor span.
- Resolution/response time: The A/D converter has to be configured for resolution and converting
scheme (first or second order). These settings influence the sampling rate, signal integration time
and this way the noise immunity
- Sample order: The order and interval of multiplexed measurements (pressure, temperature, auto
zero) has to be set
Analog output
- Choice of output method (voltage value, current loop, PWM) for output register 1.
- Optional choice of additional output register 2: PWM module via IO1 or alarm out module via
IO1/2.
Digital communication: The preferred protocol and its parameter have to be set.
Temperature
- The temperature measure channel for the temperature correction has to be chosen.
- Optional: the temperature measure channel as the second output has to be chosen.
Supply voltage : For non-ratiometric output the voltage regulation has to be configured.
Note: Not all possible combinations of settings are allowed (see section 1.5).
The calibration procedure must include
- the set of coefficients of calibration calculation
and depending on configuration,
- the adjustment of the extended offset compensation,
- the zero compensation of temperature measurement,
- the adjustment of the bridge current
and if necessary
- the set of thresholds and delays for the alarms,
- the reference voltage.
Copyright 2003, ZMD AG, Rev. 0.6.2, 2003-11-18, PRELIMINARY
5/23
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31050 RB
IC
series
Advanced Differential Sensor Signal Conditioner
Datasheet
PRELIMINARY
1.3
Analog Front End (AFE)

The analog front end consists of the programmable gain amplifier (PGA), the multiplexer (MUX) and the
analog-to-digital converter (ADC).
1.3.1.
Programmable Gain Amplifier

The following table shows the adjustable gains and the processable sensor signal spans.
No.
PGA Gain
Max. span in mV/V
1 420
2
2 300
2.8
3 210
4
4 150
5.6
5 105
8
6 75
11.2
7 52.5
16
8 37.5
22.4
9 21.75
32
10 14
45
11 10
64
12 7
90
13 3
275
Table 1: Adjustable gains and processable sensor signal spans
1.3.2.
Measurement Cycle Realized by Multiplexer
The Multiplexer selects, depending on EEPROM settings, the following inputs in a certain sequence.
Pre-amplified bridge sensor signal
Bridge temperature signal measured by external diode
Bridge temperature signal measured by internal pn-junction
Bridge temperature signal measured by bridge resistors
Separate temperature signal measured by external thermistor
Internal offset of the input channel measured by input short circuiting